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Comparing New Dielectric Materials for Chip-on-Board LED Packages

Hui, Zhang ; Wagner, Max ; Khanh, Tran Quoc (2016)
Comparing New Dielectric Materials for Chip-on-Board LED Packages.
In: LED professional Review (LpR), 58
Artikel, Bibliographie

Kurzbeschreibung (Abstract)

Light-emitting diodes used in automotive headlamps do not radiate much heat as they light up, but they create heat within the chip, or die, when the electricity passes through, which can compromise the cooling of adjacent assemblies and connectivity cables. For this reason, LED headlamps need cooling systems, such as heatsinks or fans. Also, although these solid-state devices will last a long time when they are operated at low currents and temperatures (as long as 25,000 to 100,000 hours), heat and current settings can extend or shorten this time significantly. High-power LEDs are subjected to higher junction temperatures and higher current densities than traditional devices. This causes stress on the material and may cause early light-output degradation.

Typ des Eintrags: Artikel
Erschienen: 2016
Autor(en): Hui, Zhang ; Wagner, Max ; Khanh, Tran Quoc
Art des Eintrags: Bibliographie
Titel: Comparing New Dielectric Materials for Chip-on-Board LED Packages
Sprache: Englisch
Publikationsjahr: 2016
Verlag: Luger Research e.U.
Titel der Zeitschrift, Zeitung oder Schriftenreihe: LED professional Review (LpR)
Jahrgang/Volume einer Zeitschrift: 58
Kurzbeschreibung (Abstract):

Light-emitting diodes used in automotive headlamps do not radiate much heat as they light up, but they create heat within the chip, or die, when the electricity passes through, which can compromise the cooling of adjacent assemblies and connectivity cables. For this reason, LED headlamps need cooling systems, such as heatsinks or fans. Also, although these solid-state devices will last a long time when they are operated at low currents and temperatures (as long as 25,000 to 100,000 hours), heat and current settings can extend or shorten this time significantly. High-power LEDs are subjected to higher junction temperatures and higher current densities than traditional devices. This causes stress on the material and may cause early light-output degradation.

Fachbereich(e)/-gebiet(e): 18 Fachbereich Elektrotechnik und Informationstechnik
18 Fachbereich Elektrotechnik und Informationstechnik > Institut für Elektromechanische Konstruktionen (aufgelöst 18.12.2018)
18 Fachbereich Elektrotechnik und Informationstechnik > Lichttechnik (ab Okt. 2021 umbenannt in "Adaptive Lichttechnische Systeme und Visuelle Verarbeitung")
Hinterlegungsdatum: 17 Apr 2017 08:58
Letzte Änderung: 30 Okt 2023 10:18
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