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Apparatus and method for embossing thermally deformable substrate or thermally deformable material layer on substrate

Nguyen, Duy Linh and Kurmakaev, Evgeny and Schmitt-Lewen, Martin and Löprich, Simon and Euler, Thorsten and Ernst, Uwe (2016):
Apparatus and method for embossing thermally deformable substrate or thermally deformable material layer on substrate.
[Standards, patents]

Item Type: Standards, patents
Erschienen: 2016
Creators: Nguyen, Duy Linh and Kurmakaev, Evgeny and Schmitt-Lewen, Martin and Löprich, Simon and Euler, Thorsten and Ernst, Uwe
Title: Apparatus and method for embossing thermally deformable substrate or thermally deformable material layer on substrate
Language: Chinese
Divisions: 16 Department of Mechanical Engineering > Institute of Printing Science and Technology (IDD)
16 Department of Mechanical Engineering
Date Deposited: 16 Jun 2016 09:13
Identification Number: CN000105313530A
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