Zhang, Hui ; Wagner, Max ; Khanh, Tran Quoc (2015)
Reading between the thermal lines - New dielectric materials for LED-packages.
In: Engineering Edge, 4 (2)
Artikel, Bibliographie
Kurzbeschreibung (Abstract)
One of the main aims in electronic packaging is a good heat transport away from the device, downwards through the package into the board. The LED chip is connected electrically at its top and bottom. That is why there is a need to separate the electric circuit from the metal board. This is achieved by an insulator layer, which is neither electrically nor thermally very conductive. In this study the thermal behavior of new dielectric materials in LED packages are investigated. Furthermore the influence of geometric parameters of the electrical layout has been tested by measurements and simulations.
| Typ des Eintrags: | Artikel |
|---|---|
| Erschienen: | 2015 |
| Autor(en): | Zhang, Hui ; Wagner, Max ; Khanh, Tran Quoc |
| Art des Eintrags: | Bibliographie |
| Titel: | Reading between the thermal lines - New dielectric materials for LED-packages |
| Sprache: | Englisch |
| Publikationsjahr: | 2015 |
| Titel der Zeitschrift, Zeitung oder Schriftenreihe: | Engineering Edge |
| Jahrgang/Volume einer Zeitschrift: | 4 |
| (Heft-)Nummer: | 2 |
| Kurzbeschreibung (Abstract): | One of the main aims in electronic packaging is a good heat transport away from the device, downwards through the package into the board. The LED chip is connected electrically at its top and bottom. That is why there is a need to separate the electric circuit from the metal board. This is achieved by an insulator layer, which is neither electrically nor thermally very conductive. In this study the thermal behavior of new dielectric materials in LED packages are investigated. Furthermore the influence of geometric parameters of the electrical layout has been tested by measurements and simulations. |
| Fachbereich(e)/-gebiet(e): | 18 Fachbereich Elektrotechnik und Informationstechnik 18 Fachbereich Elektrotechnik und Informationstechnik > Institut für Elektromechanische Konstruktionen (aufgelöst 18.12.2018) 18 Fachbereich Elektrotechnik und Informationstechnik > Lichttechnik (ab Okt. 2021 umbenannt in "Adaptive Lichttechnische Systeme und Visuelle Verarbeitung") |
| Hinterlegungsdatum: | 03 Mai 2016 16:36 |
| Letzte Änderung: | 30 Okt 2023 10:18 |
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