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Tunable in-package impedance matching for high power transistors based on printed ceramics

Wiens, A. and Preis, S. and Kohler, C. and Kienemund, D. and Maune, H. and Bengtsson, O. and Nikfalazar, M. and Binder, J. R. and Heinrich, W. and Jakoby, R. (2015):
Tunable in-package impedance matching for high power transistors based on printed ceramics.
In: Microwave Conference (EuMC), 2015 European, [Online-Edition: http://dx.doi.org/10.1109/EuMC.2015.7345993],
[Conference or Workshop Item]

Item Type: Conference or Workshop Item
Erschienen: 2015
Creators: Wiens, A. and Preis, S. and Kohler, C. and Kienemund, D. and Maune, H. and Bengtsson, O. and Nikfalazar, M. and Binder, J. R. and Heinrich, W. and Jakoby, R.
Title: Tunable in-package impedance matching for high power transistors based on printed ceramics
Language: German
Uncontrolled Keywords: III-V semiconductors;gallium compounds;high electron mobility transistors;impedance matching;power transistors;semiconductor device models;semiconductor device packaging;thick films;wide band gap semiconductors;GaN;HEMT;RF-power transistors;efficiency 47.1 percent;frequency 0.8 GHz to 3 GHz;functional thick film layers;high power transistors;in-package integration;loss 0.4 dB to 1.1 dB;printed ceramics;screen printing process;tunable in-package impedance matching;tunable matching networks;Inductance;Microwave amplifiers;Q measurement;Ceramics;passive components;power amplifiers;tunable filters
Divisions: 18 Department of Electrical Engineering and Information Technology
18 Department of Electrical Engineering and Information Technology > Institute for Microwave Engineering and Photonics > Microwave Engineering
18 Department of Electrical Engineering and Information Technology > Institute for Microwave Engineering and Photonics
Event Title: Microwave Conference (EuMC), 2015 European
Date Deposited: 21 Mar 2016 11:59
Official URL: http://dx.doi.org/10.1109/EuMC.2015.7345993
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