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Tunable in-package impedance matching for high power transistors based on printed ceramics

Wiens, A. ; Preis, S. ; Kohler, C. ; Kienemund, D. ; Maune, H. ; Bengtsson, O. ; Nikfalazar, M. ; Binder, J. R. ; Heinrich, W. ; Jakoby, R. (2015):
Tunable in-package impedance matching for high power transistors based on printed ceramics.
pp. 1236-1239, Microwave Conference (EuMC), 2015 European, [Conference or Workshop Item]

Item Type: Conference or Workshop Item
Erschienen: 2015
Creators: Wiens, A. ; Preis, S. ; Kohler, C. ; Kienemund, D. ; Maune, H. ; Bengtsson, O. ; Nikfalazar, M. ; Binder, J. R. ; Heinrich, W. ; Jakoby, R.
Title: Tunable in-package impedance matching for high power transistors based on printed ceramics
Language: German
Uncontrolled Keywords: III-V semiconductors;gallium compounds;high electron mobility transistors;impedance matching;power transistors;semiconductor device models;semiconductor device packaging;thick films;wide band gap semiconductors;GaN;HEMT;RF-power transistors;efficiency 47.1 percent;frequency 0.8 GHz to 3 GHz;functional thick film layers;high power transistors;in-package integration;loss 0.4 dB to 1.1 dB;printed ceramics;screen printing process;tunable in-package impedance matching;tunable matching networks;Inductance;Microwave amplifiers;Q measurement;Ceramics;passive components;power amplifiers;tunable filters
Divisions: 18 Department of Electrical Engineering and Information Technology
18 Department of Electrical Engineering and Information Technology > Institute for Microwave Engineering and Photonics > Microwave Engineering
18 Department of Electrical Engineering and Information Technology > Institute for Microwave Engineering and Photonics
Event Title: Microwave Conference (EuMC), 2015 European
Date Deposited: 21 Mar 2016 11:59
Official URL: http://dx.doi.org/10.1109/EuMC.2015.7345993
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