TU Darmstadt / ULB / TUbiblio

Improved adhesion of DLC films on copper substrates by preimplantation

Flege, Stefan and Hatada, Ruriko and Ensinger, Wolfgang and Baba, Koumei (2014):
Improved adhesion of DLC films on copper substrates by preimplantation.
In: Surface and Coatings Technology, pp. 37-40, 256, [Online-Edition: http://www.sciencedirect.com/science/article/pii/S0257897213...],
[Article]

Abstract

The adhesion of diamond-like carbon (DLC) films on copper substrates is usually very poor. However, the adhesive strength of the films can be improved by a preimplantation step. With plasma based ion implantation and deposition, the preimplantation step and the film deposition can be realized with the same experimental setup. The effect of the implantation of several different gaseous species (N2, O2, Ar, CO2, C2H4, and air) at -10 kV was investigated. For O2, N2 and C2H4 the influence of the pulse voltage (-5, -10, -15 kV) was examined. The samples were characterized by elemental depth profiling (XPS, SIMS), and the adhesion was evaluated with a pull tester. Most of the preimplantation treatments increase the adhesion of the DLC films on the copper substrates considerably to values of 10-15 MPa. The best result was obtained with -15 kV oxygen preimplantation.

Item Type: Article
Erschienen: 2014
Creators: Flege, Stefan and Hatada, Ruriko and Ensinger, Wolfgang and Baba, Koumei
Title: Improved adhesion of DLC films on copper substrates by preimplantation
Language: English
Abstract:

The adhesion of diamond-like carbon (DLC) films on copper substrates is usually very poor. However, the adhesive strength of the films can be improved by a preimplantation step. With plasma based ion implantation and deposition, the preimplantation step and the film deposition can be realized with the same experimental setup. The effect of the implantation of several different gaseous species (N2, O2, Ar, CO2, C2H4, and air) at -10 kV was investigated. For O2, N2 and C2H4 the influence of the pulse voltage (-5, -10, -15 kV) was examined. The samples were characterized by elemental depth profiling (XPS, SIMS), and the adhesion was evaluated with a pull tester. Most of the preimplantation treatments increase the adhesion of the DLC films on the copper substrates considerably to values of 10-15 MPa. The best result was obtained with -15 kV oxygen preimplantation.

Journal or Publication Title: Surface and Coatings Technology
Series Name: 12th International Workshop on Plasma Based Ion Implantation and Deposition
Volume: 256
Uncontrolled Keywords: adhesion, copper, DLC, Implantation, PBII
Divisions: 11 Department of Materials and Earth Sciences > Material Science
11 Department of Materials and Earth Sciences > Material Science > Material Analytics
11 Department of Materials and Earth Sciences
Date Deposited: 14 Sep 2014 15:59
Official URL: http://www.sciencedirect.com/science/article/pii/S0257897213...
Export:

Optionen (nur für Redakteure)

View Item View Item