Flege, Stefan ; Hatada, Ruriko ; Ensinger, Wolfgang ; Baba, Koumei (2014)
Improved adhesion of DLC films on copper substrates by preimplantation.
In: Surface and Coatings Technology, 256
Artikel, Bibliographie
Kurzbeschreibung (Abstract)
The adhesion of diamond-like carbon (DLC) films on copper substrates is usually very poor. However, the adhesive strength of the films can be improved by a preimplantation step. With plasma based ion implantation and deposition, the preimplantation step and the film deposition can be realized with the same experimental setup. The effect of the implantation of several different gaseous species (N2, O2, Ar, CO2, C2H4, and air) at -10 kV was investigated. For O2, N2 and C2H4 the influence of the pulse voltage (-5, -10, -15 kV) was examined. The samples were characterized by elemental depth profiling (XPS, SIMS), and the adhesion was evaluated with a pull tester. Most of the preimplantation treatments increase the adhesion of the DLC films on the copper substrates considerably to values of 10-15 MPa. The best result was obtained with -15 kV oxygen preimplantation.
| Typ des Eintrags: | Artikel |
|---|---|
| Erschienen: | 2014 |
| Autor(en): | Flege, Stefan ; Hatada, Ruriko ; Ensinger, Wolfgang ; Baba, Koumei |
| Art des Eintrags: | Bibliographie |
| Titel: | Improved adhesion of DLC films on copper substrates by preimplantation |
| Sprache: | Englisch |
| Publikationsjahr: | Oktober 2014 |
| Titel der Zeitschrift, Zeitung oder Schriftenreihe: | Surface and Coatings Technology |
| Jahrgang/Volume einer Zeitschrift: | 256 |
| Reihe: | 12th International Workshop on Plasma Based Ion Implantation and Deposition |
| URL / URN: | http://www.sciencedirect.com/science/article/pii/S0257897213... |
| Kurzbeschreibung (Abstract): | The adhesion of diamond-like carbon (DLC) films on copper substrates is usually very poor. However, the adhesive strength of the films can be improved by a preimplantation step. With plasma based ion implantation and deposition, the preimplantation step and the film deposition can be realized with the same experimental setup. The effect of the implantation of several different gaseous species (N2, O2, Ar, CO2, C2H4, and air) at -10 kV was investigated. For O2, N2 and C2H4 the influence of the pulse voltage (-5, -10, -15 kV) was examined. The samples were characterized by elemental depth profiling (XPS, SIMS), and the adhesion was evaluated with a pull tester. Most of the preimplantation treatments increase the adhesion of the DLC films on the copper substrates considerably to values of 10-15 MPa. The best result was obtained with -15 kV oxygen preimplantation. |
| Freie Schlagworte: | adhesion, copper, DLC, Implantation, PBII |
| Fachbereich(e)/-gebiet(e): | 11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft 11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft > Fachgebiet Materialanalytik 11 Fachbereich Material- und Geowissenschaften |
| Hinterlegungsdatum: | 14 Sep 2014 15:59 |
| Letzte Änderung: | 14 Sep 2014 15:59 |
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