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Passive wireless temperature sensing with BST-based chipless transponder

Mandel, C. and Maune, H. and Maasch, M. and Sazegar, M. and Schüßler, M. and Jakoby, Rolf (2011):
Passive wireless temperature sensing with BST-based chipless transponder.
In: Proc. of the German Microwave Conference, [Conference or Workshop Item]

Abstract

A passive wireless temperature sensor with identification capabilities based on a phase modulation scheme is discussed in this paper. The approach presented utilizes a pulse backscatter technique based on metamaterial transmission lines. The focus of the work is the material engineering for the temperature-sensitive element and its integration into a passive phase modulation circuit. The approach makes use of temperature-sensitive barium-strontium-titanate thick film capacitances. The discussed principle has been experimentally verified with a prototype.

Item Type: Conference or Workshop Item
Erschienen: 2011
Creators: Mandel, C. and Maune, H. and Maasch, M. and Sazegar, M. and Schüßler, M. and Jakoby, Rolf
Title: Passive wireless temperature sensing with BST-based chipless transponder
Language: German
Abstract:

A passive wireless temperature sensor with identification capabilities based on a phase modulation scheme is discussed in this paper. The approach presented utilizes a pulse backscatter technique based on metamaterial transmission lines. The focus of the work is the material engineering for the temperature-sensitive element and its integration into a passive phase modulation circuit. The approach makes use of temperature-sensitive barium-strontium-titanate thick film capacitances. The discussed principle has been experimentally verified with a prototype.

Uncontrolled Keywords: BST-based chipless transponder;material engineering;metamaterial transmission line;passive phase modulation circuit;passive wireless temperature sensing;passive wireless temperature sensor;pulse backscatter;radiofrequency identification;temperature-sensitive barium-strontium-titanate thick film capacitance;temperature-sensitive element;wireless sensor;backscatter;capacitance;metamaterials;passive networks;phase modulation;radiofrequency identification;temperature sensors;transmission lines;transponders;wireless sensor networks;
Divisions: 18 Department of Electrical Engineering and Information Technology > Institute for Microwave Engineering and Photonics > Microwave Engineering
18 Department of Electrical Engineering and Information Technology
18 Department of Electrical Engineering and Information Technology > Institute for Microwave Engineering and Photonics
Event Title: Proc. of the German Microwave Conference
Date Deposited: 27 Jan 2012 15:20
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