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The Influence of the Packaging on an In-Vivo Micro-Force Sensor

Meiss, Thorsten and Kern, T. A. and Klages, S. and Minamisava, C. and Wang, Y. and Werthschützky, Roland (2008):
The Influence of the Packaging on an In-Vivo Micro-Force Sensor.
In: Conf. Proc. Eurosensors, Dresden, [Conference or Workshop Item]

Item Type: Conference or Workshop Item
Erschienen: 2008
Creators: Meiss, Thorsten and Kern, T. A. and Klages, S. and Minamisava, C. and Wang, Y. and Werthschützky, Roland
Title: The Influence of the Packaging on an In-Vivo Micro-Force Sensor
Language: English
Title of Book: Conf. Proc. Eurosensors, Dresden
Divisions: 18 Department of Electrical Engineering and Information Technology > Institute for Electromechanical Design
18 Department of Electrical Engineering and Information Technology
18 Department of Electrical Engineering and Information Technology > Institute for Electromechanical Design > Measurement and Sensor Technology
Date Deposited: 15 Aug 2009 14:20
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