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Combining Embedded and Overlayer Compressive Stressors in Advanced SOI CMOS Technologies

Wei, Andy and Kammler, Thorsten and Häntschel, Jan and Bierstedt, Helmut and Biethan, Jens-Peter and Hellmich, A. and Hempel, K. and Klais, J. and Koerner, G. and Lenski, Markus and Mantei, T. and Neu, A. and Otterbach, R. and Reichel, Carsten and Trui, Bernhard and Burbach, G. and Feudel, T. and Javorka, P. and Schwan, C. and Kepler, Nick and Engelmann, H. J. and Ziemer-Popp, C. and Herzog, O. and Greenlaw, David and Raab, M and Stephan, Rolf and Horstmann, M. and Hansson, P. O. and Samoilov, A. and Sanchez, E. and Luckner, O. and Weiher-Telford, S. (2005):
Combining Embedded and Overlayer Compressive Stressors in Advanced SOI CMOS Technologies.
In: International Conference on Solid State Devices and Materials (SSDM) <Kobe (Japan),2005> ; Extended Abstracts of 2005 International Conference on Solid State Devices and Materials (SSDM) ; 32-33, [Conference or Workshop Item]

Item Type: Conference or Workshop Item
Erschienen: 2005
Creators: Wei, Andy and Kammler, Thorsten and Häntschel, Jan and Bierstedt, Helmut and Biethan, Jens-Peter and Hellmich, A. and Hempel, K. and Klais, J. and Koerner, G. and Lenski, Markus and Mantei, T. and Neu, A. and Otterbach, R. and Reichel, Carsten and Trui, Bernhard and Burbach, G. and Feudel, T. and Javorka, P. and Schwan, C. and Kepler, Nick and Engelmann, H. J. and Ziemer-Popp, C. and Herzog, O. and Greenlaw, David and Raab, M and Stephan, Rolf and Horstmann, M. and Hansson, P. O. and Samoilov, A. and Sanchez, E. and Luckner, O. and Weiher-Telford, S.
Title: Combining Embedded and Overlayer Compressive Stressors in Advanced SOI CMOS Technologies
Language: English
Series Name: International Conference on Solid State Devices and Materials (SSDM) <Kobe (Japan),2005> ; Extended Abstracts of 2005 International Conference on Solid State Devices and Materials (SSDM) ; 32-33
Divisions: 05 Department of Physics
Date Deposited: 20 Nov 2008 08:26
License: [undefiniert]
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