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Sub-grain boundary formation in Si3N4 based ceramics

Sajgalik, Pavol and Rajan, K. and Riedel, Ralf Niihara, K. and Sekino, T. and Yasuda, E. and Sasa, T. (eds.) (1999):
Sub-grain boundary formation in Si3N4 based ceramics.
In: KEY ENGINEERING MATERIALS, 2, In: SCIENCE OF ENGINEERING CERAMICS II, In: 2nd International Symposium on Science of Engineering Ceramics (EnCera 98), Osaka, Japan, SEP 06-09, 1998, pp. 229-234, DOI: 10.4028/www.scientific.net/KEM.161-163.229,
[Conference or Workshop Item]

Abstract

Present paper deals with the residual stresses localized within the grains of silicon nitride based composites. The stresses are a consequence of processing, grain growth and/or a presence of other phases with different thermal expansion. These stress fields locally weaken the grains and thus can be considered as the sub-grain boundaries which definitely influence the composite. This kind of sub-grain boundaries and their possible effect on the room temperature mechanical properties are presented for two materials, beta-Si3N4 whisker reinforced Si3N4 ceramics and SiC/Si3N4 nano-micro composites.

Item Type: Conference or Workshop Item
Erschienen: 1999
Editors: Niihara, K. and Sekino, T. and Yasuda, E. and Sasa, T.
Creators: Sajgalik, Pavol and Rajan, K. and Riedel, Ralf
Title: Sub-grain boundary formation in Si3N4 based ceramics
Language: English
Abstract:

Present paper deals with the residual stresses localized within the grains of silicon nitride based composites. The stresses are a consequence of processing, grain growth and/or a presence of other phases with different thermal expansion. These stress fields locally weaken the grains and thus can be considered as the sub-grain boundaries which definitely influence the composite. This kind of sub-grain boundaries and their possible effect on the room temperature mechanical properties are presented for two materials, beta-Si3N4 whisker reinforced Si3N4 ceramics and SiC/Si3N4 nano-micro composites.

Journal or Publication Title: Key Engineering Materials
Title of Book: SCIENCE OF ENGINEERING CERAMICS II
Series Name: KEY ENGINEERING MATERIALS
Volume: 2
Uncontrolled Keywords: silicon nitride; residual stress; sub-grain boundary; bending strength; fracture toughness; Weibull modulus
Divisions: 11 Department of Materials and Earth Sciences
11 Department of Materials and Earth Sciences > Material Science
11 Department of Materials and Earth Sciences > Material Science > Dispersive Solids
11 Department of Materials and Earth Sciences > Fachbereich Materialwissenschaft (1999 aufgegangen in 11 Fachbereich Material- und Geowissenschaften)
Event Title: 2nd International Symposium on Science of Engineering Ceramics (EnCera 98)
Event Location: Osaka, Japan
Event Dates: SEP 06-09, 1998
Date Deposited: 20 Nov 2008 08:19
DOI: 10.4028/www.scientific.net/KEM.161-163.229
License: [undefiniert]
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