Rheinschmidt, Florian ; Felger, Julian ; Rosendahl, Philipp Laurens (2025)
A closed-form analytical variational approach to thermally induced thin-film delamination.
In: Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 2024, 238 (14)
doi: 10.26083/tuprints-00027847
Artikel, Zweitveröffentlichung, Verlagsversion
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Kurzbeschreibung (Abstract)
Thin polymeric films applied on stiff substrates are prone to delamination upon thermal loading. Different thermal expansion coefficients and different elastic properties can cause localized stress concentrations in the interface between applied layer and substrate. The present work proposes a variational approach to compute residual stresses and strains within the film. Using finite element calculations, it is shown that the presented closed-form analytical solution provides accurate interfacial stresses. Employing a critical distances failure criterion, these stresses are used to predict thermally induced crack nucleation. The proposed model is validated using experimental data of thermally loaded epoxy–glass specimens. It is in good agreement with the test data and provides predictions for thin-film delamination.
| Typ des Eintrags: | Artikel |
|---|---|
| Erschienen: | 2025 |
| Autor(en): | Rheinschmidt, Florian ; Felger, Julian ; Rosendahl, Philipp Laurens |
| Art des Eintrags: | Zweitveröffentlichung |
| Titel: | A closed-form analytical variational approach to thermally induced thin-film delamination |
| Sprache: | Englisch |
| Publikationsjahr: | 18 Februar 2025 |
| Ort: | Darmstadt |
| Publikationsdatum der Erstveröffentlichung: | Juli 2024 |
| Ort der Erstveröffentlichung: | London |
| Verlag: | SAGE Publications |
| Titel der Zeitschrift, Zeitung oder Schriftenreihe: | Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science |
| Jahrgang/Volume einer Zeitschrift: | 238 |
| (Heft-)Nummer: | 14 |
| DOI: | 10.26083/tuprints-00027847 |
| URL / URN: | https://tuprints.ulb.tu-darmstadt.de/27847 |
| Zugehörige Links: | |
| Herkunft: | Zweitveröffentlichung DeepGreen |
| Kurzbeschreibung (Abstract): | Thin polymeric films applied on stiff substrates are prone to delamination upon thermal loading. Different thermal expansion coefficients and different elastic properties can cause localized stress concentrations in the interface between applied layer and substrate. The present work proposes a variational approach to compute residual stresses and strains within the film. Using finite element calculations, it is shown that the presented closed-form analytical solution provides accurate interfacial stresses. Employing a critical distances failure criterion, these stresses are used to predict thermally induced crack nucleation. The proposed model is validated using experimental data of thermally loaded epoxy–glass specimens. It is in good agreement with the test data and provides predictions for thin-film delamination. |
| Freie Schlagworte: | Thin films, stress concentrations, thermomechanical, analytical modelling |
| Status: | Verlagsversion |
| URN: | urn:nbn:de:tuda-tuprints-278478 |
| Sachgruppe der Dewey Dezimalklassifikatin (DDC): | 600 Technik, Medizin, angewandte Wissenschaften > 624 Ingenieurbau und Umwelttechnik |
| Fachbereich(e)/-gebiet(e): | 13 Fachbereich Bau- und Umweltingenieurwissenschaften 13 Fachbereich Bau- und Umweltingenieurwissenschaften > Institut für Statik und Konstruktion |
| Hinterlegungsdatum: | 30 Sep 2024 12:24 |
| Letzte Änderung: | 01 Okt 2024 08:51 |
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| Suche nach Titel in: | TUfind oder in Google |
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- A closed-form analytical variational approach to thermally induced thin-film delamination. (deposited 30 Sep 2024 12:24) [Gegenwärtig angezeigt]
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