Korner, Dominic ; Riehl, David ; Hofmann, Klaus (2023)
Ultrasonic Energy Harvesting and Communication ASIC for Sensor-Integrated Machine Elements.
MikroSystemTechnik Kongress 2023. Dresden, Germany (23.10.2023 - 25.10.2023)
Konferenzveröffentlichung, Bibliographie
Kurzbeschreibung (Abstract)
We present an application-specific integrated circuit (ASIC) for wireless ultrasound-based sensor-integrated machine elements. The ultrasound-based communication and energy transfer allows a complete encapsulation by metal, enabling the use in harsh environments. The sensor-integrated machine element contains an external sensor, an ADC, a microcontroller, a piezo crystal, and the ASIC. The ASIC handles the physical communication layer and acts as a power source at sufficient ultrasound levels. For data transmission, various communication protocols are implemented, allowing to use backscatter as well as an active transmission scheme. The microcontroller accesses the ASIC via a Serial Peripheral Interface (SPI) and can configure multiple registers to adjust the communication protocol and the transmitted data. The ASIC is designed in a 180 nm process using only 0.26 mm² of active chip area.
| Typ des Eintrags: | Konferenzveröffentlichung |
|---|---|
| Erschienen: | 2023 |
| Autor(en): | Korner, Dominic ; Riehl, David ; Hofmann, Klaus |
| Art des Eintrags: | Bibliographie |
| Titel: | Ultrasonic Energy Harvesting and Communication ASIC for Sensor-Integrated Machine Elements |
| Sprache: | Englisch |
| Publikationsjahr: | 26 Oktober 2023 |
| Verlag: | VDE |
| Buchtitel: | MikroSystemTechnik Kongress 2023 : Mikroelektronik/Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveränität : proceedings |
| Veranstaltungstitel: | MikroSystemTechnik Kongress 2023 |
| Veranstaltungsort: | Dresden, Germany |
| Veranstaltungsdatum: | 23.10.2023 - 25.10.2023 |
| URL / URN: | https://ieeexplore.ieee.org/document/10483118 |
| Kurzbeschreibung (Abstract): | We present an application-specific integrated circuit (ASIC) for wireless ultrasound-based sensor-integrated machine elements. The ultrasound-based communication and energy transfer allows a complete encapsulation by metal, enabling the use in harsh environments. The sensor-integrated machine element contains an external sensor, an ADC, a microcontroller, a piezo crystal, and the ASIC. The ASIC handles the physical communication layer and acts as a power source at sufficient ultrasound levels. For data transmission, various communication protocols are implemented, allowing to use backscatter as well as an active transmission scheme. The microcontroller accesses the ASIC via a Serial Peripheral Interface (SPI) and can configure multiple registers to adjust the communication protocol and the transmitted data. The ASIC is designed in a 180 nm process using only 0.26 mm² of active chip area. |
| Fachbereich(e)/-gebiet(e): | 18 Fachbereich Elektrotechnik und Informationstechnik 18 Fachbereich Elektrotechnik und Informationstechnik > Institut für Datentechnik 18 Fachbereich Elektrotechnik und Informationstechnik > Institut für Datentechnik > Integrierte Elektronische Systeme (IES) |
| Hinterlegungsdatum: | 27 Sep 2024 10:56 |
| Letzte Änderung: | 27 Sep 2024 10:56 |
| PPN: | |
| Export: | |
| Suche nach Titel in: | TUfind oder in Google |
 |
Frage zum Eintrag |
Optionen (nur für Redakteure)
 |
Redaktionelle Details anzeigen |
Drucken
Impressum