Mamleyev, Emil R. ; Falk, Fabian ; Weidler, Peter G. ; Heissler, Stefan ; Wadhwa, Sagar ; Nassar, Omar ; Shyam Kumar, C. N. ; Kübel, Christian ; Wöll, Christof ; Islam, Monsur ; Mager, Dario ; Korvink, Jan G. (2020)
Polyaramid-based flexible antibacterial coatings fabricated using laser-induced carbonization and copper electroplating.
In: ACS Applied Materials & Interfaces, 12 (47)
doi: 10.1021/acsami.0c13058
Artikel, Bibliographie
Kurzbeschreibung (Abstract)
A method for the fabrication of flexible electrical circuits on polyaramid substrates is presented based on laser-induced carbonization followed by copper electroplating. Locally carbonized flexible sheets of polyaramid (Nomex), by laser radiation, create rough and highly porous microstructures that show a higher degree of graphitization than thermally carbonized Nomex sheets. The found recipe for laser-induced carbonization creates conductivities of up to similar to 45 S cm(-1), thereby exceeding that observed for thermally pyrolyzed materials (similar to 38 S cm(-1)) and laser carbon derived from Kapton using the same laser wavelength (similar to 35 S cm(-1)). The electrical conductivity of the carbonized tracks was further improved by electroplating with copper. To demonstrate the electrical performance, fabricated circuits were tested and improvement of the sheet resistance was determined. Copper films exhibit antimicrobial activity and were used to fabricate customized flexible antibacterial coatings. The integration of laser carbonization and electroplating technologies in a polyaramid substrate points to the development of customized circuit designs for smart textiles operating in high-temperature environments.
Typ des Eintrags: | Artikel |
---|---|
Erschienen: | 2020 |
Autor(en): | Mamleyev, Emil R. ; Falk, Fabian ; Weidler, Peter G. ; Heissler, Stefan ; Wadhwa, Sagar ; Nassar, Omar ; Shyam Kumar, C. N. ; Kübel, Christian ; Wöll, Christof ; Islam, Monsur ; Mager, Dario ; Korvink, Jan G. |
Art des Eintrags: | Bibliographie |
Titel: | Polyaramid-based flexible antibacterial coatings fabricated using laser-induced carbonization and copper electroplating |
Sprache: | Englisch |
Publikationsjahr: | 25 November 2020 |
Verlag: | ACS Publications |
Titel der Zeitschrift, Zeitung oder Schriftenreihe: | ACS Applied Materials & Interfaces |
Jahrgang/Volume einer Zeitschrift: | 12 |
(Heft-)Nummer: | 47 |
DOI: | 10.1021/acsami.0c13058 |
Kurzbeschreibung (Abstract): | A method for the fabrication of flexible electrical circuits on polyaramid substrates is presented based on laser-induced carbonization followed by copper electroplating. Locally carbonized flexible sheets of polyaramid (Nomex), by laser radiation, create rough and highly porous microstructures that show a higher degree of graphitization than thermally carbonized Nomex sheets. The found recipe for laser-induced carbonization creates conductivities of up to similar to 45 S cm(-1), thereby exceeding that observed for thermally pyrolyzed materials (similar to 38 S cm(-1)) and laser carbon derived from Kapton using the same laser wavelength (similar to 35 S cm(-1)). The electrical conductivity of the carbonized tracks was further improved by electroplating with copper. To demonstrate the electrical performance, fabricated circuits were tested and improvement of the sheet resistance was determined. Copper films exhibit antimicrobial activity and were used to fabricate customized flexible antibacterial coatings. The integration of laser carbonization and electroplating technologies in a polyaramid substrate points to the development of customized circuit designs for smart textiles operating in high-temperature environments. |
Freie Schlagworte: | polyaramid, laser-induced carbonization, copper electroplating, flexible circuits, antibacterial coating |
Fachbereich(e)/-gebiet(e): | 11 Fachbereich Material- und Geowissenschaften 11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft 11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft > In-Situ Elektronenmikroskopie |
Hinterlegungsdatum: | 12 Jun 2024 08:02 |
Letzte Änderung: | 12 Jun 2024 08:02 |
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