Riehl, David ; Korner, Dominic ; Keil, Ferdinand ; Peters, Julian ; Matthiesen, Sven ; Hofmann, Klaus (2024)
Flexible Modular Electronic Platform for Sensor-Integrating Bolts.
12. GMM/DVS-Fachtagung: Elektronische Baugruppen und Leiterplatten - Nachhaltigkeit und Energieeffizienz mit smarter Elektronik (EBL2024). Fellbach, Germany (05.-06.03.2024)
Konferenzveröffentlichung, Bibliographie
Kurzbeschreibung (Abstract)
Condition monitoring of machines and structural buildings enables the prediction of physical damage, preventing down-times in production, and ensuring the correct operation of critical infrastructure. Sensor-integrating machine elements (SiME) offer the ability to measure relevant quantities in situ while maintaining the standardized interface and function. Due to the requirement to preserve the machine element's structural integrity, the room for integrating sensors, evaluation electronics, and energy supply is limited by strict boundaries in diameter and height. Therefore, optimizing the size of every part is necessary. Here the use of a folded flexible Printed Circuit Board (PCB) allows to fully utilize the available space while ensuring manufacturability and assembly. This paper presents a flexible ultra-low power electronic platform for sensor-integrating bolts with multi-axis force and torque measurement. The platform is divided in two modules: a flexible printed circuit board carrying the precision measurement circuitry and the power supply/communication module on a rigid multilayer PCB. The modular platform reduces design risk and allows an evaluation of different power supply and communication concepts.
Typ des Eintrags: | Konferenzveröffentlichung |
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Erschienen: | 2024 |
Autor(en): | Riehl, David ; Korner, Dominic ; Keil, Ferdinand ; Peters, Julian ; Matthiesen, Sven ; Hofmann, Klaus |
Art des Eintrags: | Bibliographie |
Titel: | Flexible Modular Electronic Platform for Sensor-Integrating Bolts |
Sprache: | Englisch |
Publikationsjahr: | 6 März 2024 |
Verlag: | VDE-Verlag |
Buchtitel: | EBL 2024: Elektronische Baugruppen und Leiterplatten |
Reihe: | GMM-Fachbericht |
Band einer Reihe: | 107 |
Veranstaltungstitel: | 12. GMM/DVS-Fachtagung: Elektronische Baugruppen und Leiterplatten - Nachhaltigkeit und Energieeffizienz mit smarter Elektronik (EBL2024) |
Veranstaltungsort: | Fellbach, Germany |
Veranstaltungsdatum: | 05.-06.03.2024 |
Kurzbeschreibung (Abstract): | Condition monitoring of machines and structural buildings enables the prediction of physical damage, preventing down-times in production, and ensuring the correct operation of critical infrastructure. Sensor-integrating machine elements (SiME) offer the ability to measure relevant quantities in situ while maintaining the standardized interface and function. Due to the requirement to preserve the machine element's structural integrity, the room for integrating sensors, evaluation electronics, and energy supply is limited by strict boundaries in diameter and height. Therefore, optimizing the size of every part is necessary. Here the use of a folded flexible Printed Circuit Board (PCB) allows to fully utilize the available space while ensuring manufacturability and assembly. This paper presents a flexible ultra-low power electronic platform for sensor-integrating bolts with multi-axis force and torque measurement. The platform is divided in two modules: a flexible printed circuit board carrying the precision measurement circuitry and the power supply/communication module on a rigid multilayer PCB. The modular platform reduces design risk and allows an evaluation of different power supply and communication concepts. |
Fachbereich(e)/-gebiet(e): | 18 Fachbereich Elektrotechnik und Informationstechnik 18 Fachbereich Elektrotechnik und Informationstechnik > Institut für Datentechnik 18 Fachbereich Elektrotechnik und Informationstechnik > Institut für Datentechnik > Integrierte Elektronische Systeme (IES) |
Hinterlegungsdatum: | 12 Apr 2024 10:59 |
Letzte Änderung: | 12 Apr 2024 10:59 |
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