Herzog, Alexander G. ; Wagner, Max ; Benkner, Simon ; Zandi, Babak ; Van Driel, Willem D. ; Khanh, Tran Quoc (2022)
Long-Term Temperature-Dependent Degradation of 175 W Chip-on-Board LED Modules.
In: IEEE Transactions on Electron Devices, 69 (12)
doi: 10.1109/TED.2022.3214169
Artikel, Bibliographie
Kurzbeschreibung (Abstract)
We report on the degradation dynamics and mechanisms of the commercially available chip-on-board (COB) high-power light-emitting diode (LED) modules with an electrical power of 175 W. Due to the associated thermal load, the temperature dependence of the aging processes is additionally analyzed within the scope of this work. The aging tests were performed for a period of 6000 h at four different case temperatures between 55 °C and 120 °C. The results of the accelerated stress tests indicate a temperature-activated aging process, which severely limits the lifetime of the modules. In addition, the following key findings can be reported: 1) a significant decrease in optical power occurs within 6000 h of operation; 2) depending on the stress test condition the accompanying color shifts exceed a limit of Δu′v′=0.007 ; and 3) the limiting degradation mechanism can be attributed to the package of the device and can be accelerated with temperature, current, and chemicals. Reported findings can be manifested by additional optical material inspections, allowing to use the results for optimizations of future module generations.
| Typ des Eintrags: | Artikel |
|---|---|
| Erschienen: | 2022 |
| Autor(en): | Herzog, Alexander G. ; Wagner, Max ; Benkner, Simon ; Zandi, Babak ; Van Driel, Willem D. ; Khanh, Tran Quoc |
| Art des Eintrags: | Bibliographie |
| Titel: | Long-Term Temperature-Dependent Degradation of 175 W Chip-on-Board LED Modules |
| Sprache: | Englisch |
| Publikationsjahr: | 1 Dezember 2022 |
| Verlag: | IEEE |
| Titel der Zeitschrift, Zeitung oder Schriftenreihe: | IEEE Transactions on Electron Devices |
| Jahrgang/Volume einer Zeitschrift: | 69 |
| (Heft-)Nummer: | 12 |
| DOI: | 10.1109/TED.2022.3214169 |
| Kurzbeschreibung (Abstract): | We report on the degradation dynamics and mechanisms of the commercially available chip-on-board (COB) high-power light-emitting diode (LED) modules with an electrical power of 175 W. Due to the associated thermal load, the temperature dependence of the aging processes is additionally analyzed within the scope of this work. The aging tests were performed for a period of 6000 h at four different case temperatures between 55 °C and 120 °C. The results of the accelerated stress tests indicate a temperature-activated aging process, which severely limits the lifetime of the modules. In addition, the following key findings can be reported: 1) a significant decrease in optical power occurs within 6000 h of operation; 2) depending on the stress test condition the accompanying color shifts exceed a limit of Δu′v′=0.007 ; and 3) the limiting degradation mechanism can be attributed to the package of the device and can be accelerated with temperature, current, and chemicals. Reported findings can be manifested by additional optical material inspections, allowing to use the results for optimizations of future module generations. |
| Fachbereich(e)/-gebiet(e): | 18 Fachbereich Elektrotechnik und Informationstechnik 18 Fachbereich Elektrotechnik und Informationstechnik > Lichttechnik (ab Okt. 2021 umbenannt in "Adaptive Lichttechnische Systeme und Visuelle Verarbeitung") |
| Hinterlegungsdatum: | 30 Okt 2023 09:58 |
| Letzte Änderung: | 30 Okt 2023 10:18 |
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