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Heat Fluxes and Temperatures in Chip-on-Board LEDs for Different Package Structures and Phosphor Technologies

Wagner, Max and Herzog, Alexander G. and Khanh, Tran Quoc (2018):
Heat Fluxes and Temperatures in Chip-on-Board LEDs for Different Package Structures and Phosphor Technologies.
In: Proceedings of the 8th LED professional Symposium + Expo, Bregenz, Luger Research e.U., In: LED professional Symposium + Expo 2018, Bregenz, 25-27. September 2018, [Conference or Workshop Item]

Item Type: Conference or Workshop Item
Erschienen: 2018
Creators: Wagner, Max and Herzog, Alexander G. and Khanh, Tran Quoc
Title: Heat Fluxes and Temperatures in Chip-on-Board LEDs for Different Package Structures and Phosphor Technologies
Language: English
Title of Book: Proceedings of the 8th LED professional Symposium + Expo
Place of Publication: Bregenz
Publisher: Luger Research e.U.
Divisions: 18 Department of Electrical Engineering and Information Technology
18 Department of Electrical Engineering and Information Technology > Institute for Electromechanical Design
18 Department of Electrical Engineering and Information Technology > Institute for Electromechanical Design > Light Technology
Event Title: LED professional Symposium + Expo 2018
Event Location: Bregenz
Event Dates: 25-27. September 2018
Date Deposited: 13 Dec 2018 14:16
Identification Number: ISBN 978-3-9503209-9-2
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