Luan, Xin’gang ; Chang, Sen ; Riedel, Ralf ; Cheng, Laifei (2018)
An air stable high temperature adhesive from modified SiBCN precursor synthesized via polymer-derived-ceramic route.
In: Ceramics International, 44 (7)
doi: 10.1016/j.ceramint.2018.02.045
Artikel, Bibliographie
Kurzbeschreibung (Abstract)
The high temperature adhesives are required in most critical applications such as nuclear and aerospace technology. To obtain an adhesive with high temperature bond strength and low synthesis temperature, polysilazane (PSNB) was modified by PBSZ, PSO, nano-Al2O3 additives. Effect of the SiO2 to B2O3 ratio and curing pressure on microstructure and high temperature bond strength has been investigated. After curing and heat-treating at comparatively lower temperatures, the bond strength of the modified adhesive reached up to 12.08 MPa, at room temperature, and, more significantly, retained the strength of 6.65 MPa at 1000 °C. The bond strength of modified adhesive is two-times higher than pure PSNB adhesive at elevated temperature. We demonstrate that optimum level of fluidity and applied pressure should be established in order to attain maximum bond strength. This paper open up avenues for further research in modifying existing adhesives for high temperature applications.
| Typ des Eintrags: | Artikel |
|---|---|
| Erschienen: | 2018 |
| Autor(en): | Luan, Xin’gang ; Chang, Sen ; Riedel, Ralf ; Cheng, Laifei |
| Art des Eintrags: | Bibliographie |
| Titel: | An air stable high temperature adhesive from modified SiBCN precursor synthesized via polymer-derived-ceramic route |
| Sprache: | Englisch |
| Publikationsjahr: | Mai 2018 |
| Verlag: | Elsevier Science Publishing |
| Titel der Zeitschrift, Zeitung oder Schriftenreihe: | Ceramics International |
| Jahrgang/Volume einer Zeitschrift: | 44 |
| (Heft-)Nummer: | 7 |
| DOI: | 10.1016/j.ceramint.2018.02.045 |
| URL / URN: | https://doi.org/10.1016/j.ceramint.2018.02.045 |
| Kurzbeschreibung (Abstract): | The high temperature adhesives are required in most critical applications such as nuclear and aerospace technology. To obtain an adhesive with high temperature bond strength and low synthesis temperature, polysilazane (PSNB) was modified by PBSZ, PSO, nano-Al2O3 additives. Effect of the SiO2 to B2O3 ratio and curing pressure on microstructure and high temperature bond strength has been investigated. After curing and heat-treating at comparatively lower temperatures, the bond strength of the modified adhesive reached up to 12.08 MPa, at room temperature, and, more significantly, retained the strength of 6.65 MPa at 1000 °C. The bond strength of modified adhesive is two-times higher than pure PSNB adhesive at elevated temperature. We demonstrate that optimum level of fluidity and applied pressure should be established in order to attain maximum bond strength. This paper open up avenues for further research in modifying existing adhesives for high temperature applications. |
| Freie Schlagworte: | Polysilazane, High temperature adhesive, Low temperature synthesis, Glass phase, Columnar and reticular carriers |
| Fachbereich(e)/-gebiet(e): | 11 Fachbereich Material- und Geowissenschaften 11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft 11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft > Fachgebiet Disperse Feststoffe |
| Hinterlegungsdatum: | 07 Jun 2018 08:07 |
| Letzte Änderung: | 07 Jun 2018 08:07 |
| PPN: | |
| Sponsoren: | The authors acknowledge the financial supports from the Research Fund of the State Key Laboratory of Solidification Processing (NWPU), China (Grant No. 135-QP-2015), the National Key Research and Development Program of China (No. 2017YFB0703200)., And Fundamental Research Funds for the Central Universities (Grant No. 3102017zy058). |
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