Schilling, Frank (1997):
Simulation of thermal induced package effects with regard to piezoresistive pressure sensors.
In: Sensors and actuators. A 60 (1997), S. 37-39, [Article]
| Item Type: | Article |
|---|---|
| Erschienen: | 1997 |
| Creators: | Schilling, Frank |
| Title: | Simulation of thermal induced package effects with regard to piezoresistive pressure sensors |
| Language: | English |
| Journal or Publication Title: | Sensors and actuators. A 60 (1997), S. 37-39 |
| Divisions: | 18 Department of Electrical Engineering and Information Technology |
| Date Deposited: | 19 Nov 2008 16:04 |
| License: | [undefiniert] |
| Export: | |
| Suche nach Titel in: | TUfind oder in Google |
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