Casper, Thorben ; De Gersem, Herbert ; Gillon, Renaud ; Gotthans, Tomas ; Kratochvíl, Tomáš ; Meuris, Peter ; Schöps, Sebastian
Fanucci, Luca ; Teich, Jürgen (eds.) (2016):
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries.
In: Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE), pp. 1297-1302, IEEE, ISBN 978-3-9815370-6-2,
[Book Section]
URL / URN: http://ieeexplore.ieee.org/document/7459510
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