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Measurement of the mechanical stability of semiconductor line structures in drying liquids with application to pattern collapse

Peter, Daniel ; Dalmer, Michael ; Lechner, Alfred ; Gigler, Alexander M. ; Stark, Robert W. ; Bensch, Wolfgang (2011)
Measurement of the mechanical stability of semiconductor line structures in drying liquids with application to pattern collapse.
In: Journal of Micromechanics and Microengineering, 21 (2)
Article, Bibliographie

Item Type: Article
Erschienen: 2011
Creators: Peter, Daniel ; Dalmer, Michael ; Lechner, Alfred ; Gigler, Alexander M. ; Stark, Robert W. ; Bensch, Wolfgang
Type of entry: Bibliographie
Title: Measurement of the mechanical stability of semiconductor line structures in drying liquids with application to pattern collapse
Language: German
Date: 2011
Journal or Publication Title: Journal of Micromechanics and Microengineering
Volume of the journal: 21
Issue Number: 2
URL / URN: http://dx.doi.org/10.1088/0960-1317/21/2/025001
Divisions: 11 Department of Materials and Earth Sciences
11 Department of Materials and Earth Sciences > Material Science
11 Department of Materials and Earth Sciences > Material Science > Physics of Surfaces
DFG-Collaborative Research Centres (incl. Transregio)
DFG-Collaborative Research Centres (incl. Transregio) > Collaborative Research Centres
Exzellenzinitiative
Exzellenzinitiative > Clusters of Excellence
Zentrale Einrichtungen
Exzellenzinitiative > Clusters of Excellence > Center of Smart Interfaces (CSI)
Date Deposited: 20 Jul 2016 12:33
Last Modified: 21 Mar 2019 11:55
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