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Apparatus and method for embossing thermally deformable substrate or thermally deformable material layer on substrate

Nguyen, Duy Linh ; Kurmakaev, Evgeny ; Schmitt-Lewen, Martin ; Löprich, Simon ; Euler, Thorsten ; Ernst, Uwe (2016):
Apparatus and method for embossing thermally deformable substrate or thermally deformable material layer on substrate.
CN 000105313530A,
[Norm, patent, standard]

Item Type: Norm, patent, standard
Erschienen: 2016
Creators: Nguyen, Duy Linh ; Kurmakaev, Evgeny ; Schmitt-Lewen, Martin ; Löprich, Simon ; Euler, Thorsten ; Ernst, Uwe
Title: Apparatus and method for embossing thermally deformable substrate or thermally deformable material layer on substrate
Language: Chinese
Patent number: CN 000105313530A
Divisions: 16 Department of Mechanical Engineering
16 Department of Mechanical Engineering > Institute of Printing Science and Technology (IDD)
Date Deposited: 16 Jun 2016 09:13
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