Schiwek, Simon ; Heim, Lars-Oliver ; Stark, Robert W. ; Dietz, Christian (2015)
Manipulation of polystyrene nanoparticles on a silicon wafer in the peak force tapping mode in water: pH-dependent friction and adhesion force.
In: Journal of Applied Physics, 117 (10)
Article
Abstract
The friction force between nanoparticles and a silicon wafer is a crucial parameter for cleaning processes in the semiconductor industry. However, little is known about the pH-dependency of the friction forces and the shear strength at the interface. Here, we push polystyrene nanoparticles, 100 nm in diameter, with the tip of an atomic force microscope and measure the pH-dependency of the friction, adhesion, and normal forces on a silicon substrate covered with a native silicon dioxide layer. The peak force tapping mode was applied to control the vertical force on these particles. We successively increased the applied load until the particles started to move. The main advantage of this technique over single manipulation processes is the achievement of a large number of manipulation events in short time and in a straightforward manner. Geometrical considerations of the interaction forces at the tip-particle interface allowed us to calculate the friction force and shear strength from the applied normal force depending on the pH of an aqueous solution. The results clearly demonstrated that particle removal should be performed with a basic solution at pH 9 because of the low interaction forces between particle and substrate. (C) 2015 AIP Publishing LLC.
Item Type: | Article |
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Erschienen: | 2015 |
Creators: | Schiwek, Simon ; Heim, Lars-Oliver ; Stark, Robert W. ; Dietz, Christian |
Type of entry: | Bibliographie |
Title: | Manipulation of polystyrene nanoparticles on a silicon wafer in the peak force tapping mode in water: pH-dependent friction and adhesion force |
Language: | English |
Date: | 14 March 2015 |
Publisher: | AMER INST PHYSICS, MELVILLE, NY USA |
Journal or Publication Title: | Journal of Applied Physics |
Volume of the journal: | 117 |
Issue Number: | 10 |
URL / URN: | http://dx.doi.org/10.1063/1.4914354 |
Abstract: | The friction force between nanoparticles and a silicon wafer is a crucial parameter for cleaning processes in the semiconductor industry. However, little is known about the pH-dependency of the friction forces and the shear strength at the interface. Here, we push polystyrene nanoparticles, 100 nm in diameter, with the tip of an atomic force microscope and measure the pH-dependency of the friction, adhesion, and normal forces on a silicon substrate covered with a native silicon dioxide layer. The peak force tapping mode was applied to control the vertical force on these particles. We successively increased the applied load until the particles started to move. The main advantage of this technique over single manipulation processes is the achievement of a large number of manipulation events in short time and in a straightforward manner. Geometrical considerations of the interaction forces at the tip-particle interface allowed us to calculate the friction force and shear strength from the applied normal force depending on the pH of an aqueous solution. The results clearly demonstrated that particle removal should be performed with a basic solution at pH 9 because of the low interaction forces between particle and substrate. (C) 2015 AIP Publishing LLC. |
Identification Number: | doi:10.1063/1.4914354 |
Divisions: | 11 Department of Materials and Earth Sciences 11 Department of Materials and Earth Sciences > Material Science 11 Department of Materials and Earth Sciences > Material Science > Physics of Surfaces Profile Areas Profile Areas > Thermo-Fluids & Interfaces Exzellenzinitiative Exzellenzinitiative > Clusters of Excellence Zentrale Einrichtungen |
Date Deposited: | 08 Jun 2016 08:53 |
Last Modified: | 15 Mar 2019 08:23 |
PPN: | |
Funders: | We thank Lam Research AG (Villach, Austria) for the financial support. |
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