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Field Effect Transistor Arrangement

Krauss, Tillmann ; Wessely, Frank ; Schwalke, Udo (2014)
Field Effect Transistor Arrangement.
Norm, patent, standard, Bibliographie

Abstract

The invention relates to a field effect transistor arrangement having a planar channel layer (1) consisting of semiconductor material, the whole surface of the underside of said layer being applied to an upper side of an electrically insulating substrate layer (2) and the upper side of said planar channel layer being covered by an insulation layer (3). The arrangement has a source electrode (6) on a first side edge of the channel layer (1) and a drain electrode (7) on a second side edge of the channel layer (1) and a control electrode (9) arranged above the channel layer (1). An adjusting electrode (5) is arranged on an underside of the substrate layer (2). A contact region (8) between the source and drain electrodes (6) and the planar channel layer (1) is in each case configured as a midgap Schottky barrier. A respective barrier control electrode (10) is arranged in the vicinity of the contact region (8) of the source electrode (6) and of the drain electrode (6). Each barrier control electrode (10) can have a section (11) that projects outwards in the direction of the planar channel layer (1).

Item Type: Norm, patent, standard
Erschienen: 2014
Creators: Krauss, Tillmann ; Wessely, Frank ; Schwalke, Udo
Type of entry: Bibliographie
Title: Field Effect Transistor Arrangement
Language: English
Date: 31 December 2014
Patent number: PCT/EP 2014/063459
URL / URN: https://patentscope.wipo.int/search/en/detail.jsf?docId=WO20...
Abstract:

The invention relates to a field effect transistor arrangement having a planar channel layer (1) consisting of semiconductor material, the whole surface of the underside of said layer being applied to an upper side of an electrically insulating substrate layer (2) and the upper side of said planar channel layer being covered by an insulation layer (3). The arrangement has a source electrode (6) on a first side edge of the channel layer (1) and a drain electrode (7) on a second side edge of the channel layer (1) and a control electrode (9) arranged above the channel layer (1). An adjusting electrode (5) is arranged on an underside of the substrate layer (2). A contact region (8) between the source and drain electrodes (6) and the planar channel layer (1) is in each case configured as a midgap Schottky barrier. A respective barrier control electrode (10) is arranged in the vicinity of the contact region (8) of the source electrode (6) and of the drain electrode (6). Each barrier control electrode (10) can have a section (11) that projects outwards in the direction of the planar channel layer (1).

Divisions: 18 Department of Electrical Engineering and Information Technology
18 Department of Electrical Engineering and Information Technology > Institute for Semiconductor Technology and Nano-Electronics
Date Deposited: 19 Apr 2016 12:50
Last Modified: 16 Dec 2020 11:18
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