Krauss, Tillmann ; Wessely, Frank ; Schwalke, Udo (2014)
Field Effect Transistor Arrangement.
Norm, patent, standard, Bibliographie
Abstract
The invention relates to a field effect transistor arrangement having a planar channel layer (1) consisting of semiconductor material, the whole surface of the underside of said layer being applied to an upper side of an electrically insulating substrate layer (2) and the upper side of said planar channel layer being covered by an insulation layer (3). The arrangement has a source electrode (6) on a first side edge of the channel layer (1) and a drain electrode (7) on a second side edge of the channel layer (1) and a control electrode (9) arranged above the channel layer (1). An adjusting electrode (5) is arranged on an underside of the substrate layer (2). A contact region (8) between the source and drain electrodes (6) and the planar channel layer (1) is in each case configured as a midgap Schottky barrier. A respective barrier control electrode (10) is arranged in the vicinity of the contact region (8) of the source electrode (6) and of the drain electrode (6). Each barrier control electrode (10) can have a section (11) that projects outwards in the direction of the planar channel layer (1).
Item Type: | Norm, patent, standard |
---|---|
Erschienen: | 2014 |
Creators: | Krauss, Tillmann ; Wessely, Frank ; Schwalke, Udo |
Type of entry: | Bibliographie |
Title: | Field Effect Transistor Arrangement |
Language: | English |
Date: | 31 December 2014 |
Patent number: | PCT/EP 2014/063459 |
URL / URN: | https://patentscope.wipo.int/search/en/detail.jsf?docId=WO20... |
Abstract: | The invention relates to a field effect transistor arrangement having a planar channel layer (1) consisting of semiconductor material, the whole surface of the underside of said layer being applied to an upper side of an electrically insulating substrate layer (2) and the upper side of said planar channel layer being covered by an insulation layer (3). The arrangement has a source electrode (6) on a first side edge of the channel layer (1) and a drain electrode (7) on a second side edge of the channel layer (1) and a control electrode (9) arranged above the channel layer (1). An adjusting electrode (5) is arranged on an underside of the substrate layer (2). A contact region (8) between the source and drain electrodes (6) and the planar channel layer (1) is in each case configured as a midgap Schottky barrier. A respective barrier control electrode (10) is arranged in the vicinity of the contact region (8) of the source electrode (6) and of the drain electrode (6). Each barrier control electrode (10) can have a section (11) that projects outwards in the direction of the planar channel layer (1). |
Divisions: | 18 Department of Electrical Engineering and Information Technology 18 Department of Electrical Engineering and Information Technology > Institute for Semiconductor Technology and Nano-Electronics |
Date Deposited: | 19 Apr 2016 12:50 |
Last Modified: | 16 Dec 2020 11:18 |
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