Wiens, A. ; Preis, S. ; Kohler, C. ; Kienemund, D. ; Maune, H. ; Bengtsson, O. ; Nikfalazar, M. ; Binder, J. R. ; Heinrich, W. ; Jakoby, R. (2015):
Tunable in-package impedance matching for high power transistors based on printed ceramics.
pp. 1236-1239, Microwave Conference (EuMC), 2015 European, [Conference or Workshop Item]
URL / URN: http://dx.doi.org/10.1109/EuMC.2015.7345993
| Item Type: | Conference or Workshop Item |
|---|---|
| Erschienen: | 2015 |
| Creators: | Wiens, A. ; Preis, S. ; Kohler, C. ; Kienemund, D. ; Maune, H. ; Bengtsson, O. ; Nikfalazar, M. ; Binder, J. R. ; Heinrich, W. ; Jakoby, R. |
| Title: | Tunable in-package impedance matching for high power transistors based on printed ceramics |
| Language: | German |
| Uncontrolled Keywords: | III-V semiconductors;gallium compounds;high electron mobility transistors;impedance matching;power transistors;semiconductor device models;semiconductor device packaging;thick films;wide band gap semiconductors;GaN;HEMT;RF-power transistors;efficiency 47.1 percent;frequency 0.8 GHz to 3 GHz;functional thick film layers;high power transistors;in-package integration;loss 0.4 dB to 1.1 dB;printed ceramics;screen printing process;tunable in-package impedance matching;tunable matching networks;Inductance;Microwave amplifiers;Q measurement;Ceramics;passive components;power amplifiers;tunable filters |
| Divisions: | 18 Department of Electrical Engineering and Information Technology 18 Department of Electrical Engineering and Information Technology > Institute for Microwave Engineering and Photonics (IMP) > Microwave Engineering 18 Department of Electrical Engineering and Information Technology > Institute for Microwave Engineering and Photonics (IMP) |
| Event Title: | Microwave Conference (EuMC), 2015 European |
| Date Deposited: | 21 Mar 2016 11:59 |
| URL / URN: | http://dx.doi.org/10.1109/EuMC.2015.7345993 |
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