Wiens, A. ; Preis, S. ; Kohler, C. ; Kienemund, D. ; Maune, H. ; Bengtsson, O. ; Nikfalazar, M. ; Binder, J. R. ; Heinrich, W. ; Jakoby, R. (2015)
Tunable in-package impedance matching for high power transistors based on printed ceramics.
Microwave Integrated Circuits Conference (EuMIC), 2015 10th European.
Conference or Workshop Item, Bibliographie
URL / URN: http://dx.doi.org/10.1109/EuMIC.2015.7345150
Item Type: | Conference or Workshop Item |
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Erschienen: | 2015 |
Creators: | Wiens, A. ; Preis, S. ; Kohler, C. ; Kienemund, D. ; Maune, H. ; Bengtsson, O. ; Nikfalazar, M. ; Binder, J. R. ; Heinrich, W. ; Jakoby, R. |
Type of entry: | Bibliographie |
Title: | Tunable in-package impedance matching for high power transistors based on printed ceramics |
Language: | German |
Date: | September 2015 |
Event Title: | Microwave Integrated Circuits Conference (EuMIC), 2015 10th European |
URL / URN: | http://dx.doi.org/10.1109/EuMIC.2015.7345150 |
Uncontrolled Keywords: | III-V semiconductors;ceramic packaging;gallium compounds;high electron mobility transistors;impedance matching;power transistors;wide band gap semiconductors;GaN;HEMT;RF-power transistors;efficiency 47.1 percent;frequency 0.8 GHz to 3 GHz;functional thick film layers;high power transistors;insertion loss;printed ceramics;screen printing process;tunable in-package impedance matching;tunable matching networks;Impedance;Insertion loss;Power generation;Transistors;Tuning;Varactors;Wires;Ceramics;passive components;power amplifiers;tunable filters |
Divisions: | 18 Department of Electrical Engineering and Information Technology 18 Department of Electrical Engineering and Information Technology > Institute for Microwave Engineering and Photonics (IMP) > Microwave Engineering 18 Department of Electrical Engineering and Information Technology > Institute for Microwave Engineering and Photonics (IMP) |
Date Deposited: | 21 Mar 2016 12:01 |
Last Modified: | 13 Dec 2019 09:55 |
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