Meiss, Thorsten ; Kern, T. A. ; Klages, S. ; Minamisava, C. ; Wang, Y. ; Werthschützky, Roland (2008)
The Influence of the Packaging on an In-Vivo Micro-Force Sensor.
Conference or Workshop Item, Bibliographie
| Item Type: | Conference or Workshop Item |
|---|---|
| Erschienen: | 2008 |
| Creators: | Meiss, Thorsten ; Kern, T. A. ; Klages, S. ; Minamisava, C. ; Wang, Y. ; Werthschützky, Roland |
| Type of entry: | Bibliographie |
| Title: | The Influence of the Packaging on an In-Vivo Micro-Force Sensor |
| Language: | English |
| Date: | 15 August 2008 |
| Book Title: | Conf. Proc. Eurosensors, Dresden |
| Divisions: | 18 Department of Electrical Engineering and Information Technology > Institute for Electromechanical Design (dissolved 18.12.2018) 18 Department of Electrical Engineering and Information Technology 18 Department of Electrical Engineering and Information Technology > Measurement and Sensor Technology |
| Date Deposited: | 15 Aug 2009 14:20 |
| Last Modified: | 05 Mar 2013 09:21 |
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