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Solder fatigue life modeling of QFN components based on design of experiments

Käß, Markus ; Schmidt, Hendrik ; Hülsebrock, Moritz ; Lichtinger, Roland ; Bein, Thilo (2024)
Solder fatigue life modeling of QFN components based on design of experiments.
In: Microelectronics Reliability, 152
doi: 10.1016/j.microrel.2023.115297
Article, Bibliographie

Item Type: Article
Erschienen: 2024
Creators: Käß, Markus ; Schmidt, Hendrik ; Hülsebrock, Moritz ; Lichtinger, Roland ; Bein, Thilo
Type of entry: Bibliographie
Title: Solder fatigue life modeling of QFN components based on design of experiments
Language: English
Date: 2024
Publisher: Elsevier
Journal or Publication Title: Microelectronics Reliability
Volume of the journal: 152
DOI: 10.1016/j.microrel.2023.115297
Identification Number: Artikel-ID: 115297
Divisions: 16 Department of Mechanical Engineering
16 Department of Mechanical Engineering > Research group System Reliability, Adaptive Structures, and Machine Acoustics (SAM)
Date Deposited: 08 Aug 2024 08:29
Last Modified: 08 Aug 2024 12:26
PPN: 520442555
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