Käß, Markus ; Schmidt, Hendrik ; Hülsebrock, Moritz ; Lichtinger, Roland ; Bein, Thilo (2024)
Solder fatigue life modeling of QFN components based on design of experiments.
In: Microelectronics Reliability, 152
doi: 10.1016/j.microrel.2023.115297
Article, Bibliographie
Item Type: | Article |
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Erschienen: | 2024 |
Creators: | Käß, Markus ; Schmidt, Hendrik ; Hülsebrock, Moritz ; Lichtinger, Roland ; Bein, Thilo |
Type of entry: | Bibliographie |
Title: | Solder fatigue life modeling of QFN components based on design of experiments |
Language: | English |
Date: | 2024 |
Publisher: | Elsevier |
Journal or Publication Title: | Microelectronics Reliability |
Volume of the journal: | 152 |
DOI: | 10.1016/j.microrel.2023.115297 |
Identification Number: | Artikel-ID: 115297 |
Divisions: | 16 Department of Mechanical Engineering 16 Department of Mechanical Engineering > Research group System Reliability, Adaptive Structures, and Machine Acoustics (SAM) |
Date Deposited: | 08 Aug 2024 08:29 |
Last Modified: | 08 Aug 2024 12:26 |
PPN: | 520442555 |
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