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Functionally graded materials by electrochemical processing and infiltration: application to tungsten/copper composites

Jedamzik, Ralf ; Neubrand, Achim ; Rödel, Jürgen (2000)
Functionally graded materials by electrochemical processing and infiltration: application to tungsten/copper composites.
In: Journal of Materials Science, 35 (2)
doi: 10.1023/A:100473590498
Article, Bibliographie

Item Type: Article
Erschienen: 2000
Creators: Jedamzik, Ralf ; Neubrand, Achim ; Rödel, Jürgen
Type of entry: Bibliographie
Title: Functionally graded materials by electrochemical processing and infiltration: application to tungsten/copper composites
Language: English
Date: January 2000
Publisher: Springer Nature
Journal or Publication Title: Journal of Materials Science
Volume of the journal: 35
Issue Number: 2
DOI: 10.1023/A:100473590498
Divisions: 11 Department of Materials and Earth Sciences
11 Department of Materials and Earth Sciences > Material Science
11 Department of Materials and Earth Sciences > Material Science > Nonmetallic-Inorganic Materials
Date Deposited: 19 Nov 2008 16:24
Last Modified: 12 Jul 2021 12:34
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