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Wideband evaluation of two types of slow‐wave microstrip lines

Wang, Dongwei ; Polat, Ersin ; Tesmer, Henning ; Jakoby, Rolf (2022)
Wideband evaluation of two types of slow‐wave microstrip lines.
In: Electronics Letters, 2022, 58 (4)
doi: 10.26083/tuprints-00021176
Article, Secondary publication, Publisher's Version

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Abstract

The design, characterization and comparison of two widely used approaches in realizing slow-wave effect on microstrip transmission lines, that is stub loaded and defected ground structure loaded microstrip lines are presented in a wide bandwidth (10–67 GHz) for the first time. Transparent substrate and dielectric material are chosen to ease the alignment of electrode and ground plane. Thin dielectric layer are applied to make the comparison prominent. The results indicate that defected ground structure loaded microstrip line has better RF performance in terms of compactness and insertion loss than stub loaded method within the whole band especially in thin film applications.

Item Type: Article
Erschienen: 2022
Creators: Wang, Dongwei ; Polat, Ersin ; Tesmer, Henning ; Jakoby, Rolf
Type of entry: Secondary publication
Title: Wideband evaluation of two types of slow‐wave microstrip lines
Language: English
Date: 2022
Year of primary publication: 2022
Publisher: Wiley
Journal or Publication Title: Electronics Letters
Volume of the journal: 58
Issue Number: 4
DOI: 10.26083/tuprints-00021176
URL / URN: https://tuprints.ulb.tu-darmstadt.de/21176
Corresponding Links:
Origin: Secondary publication via sponsored Golden Open Access
Abstract:

The design, characterization and comparison of two widely used approaches in realizing slow-wave effect on microstrip transmission lines, that is stub loaded and defected ground structure loaded microstrip lines are presented in a wide bandwidth (10–67 GHz) for the first time. Transparent substrate and dielectric material are chosen to ease the alignment of electrode and ground plane. Thin dielectric layer are applied to make the comparison prominent. The results indicate that defected ground structure loaded microstrip line has better RF performance in terms of compactness and insertion loss than stub loaded method within the whole band especially in thin film applications.

Status: Publisher's Version
URN: urn:nbn:de:tuda-tuprints-211761
Classification DDC: 600 Technology, medicine, applied sciences > 620 Engineering and machine engineering
Divisions: 18 Department of Electrical Engineering and Information Technology
18 Department of Electrical Engineering and Information Technology > Institute for Microwave Engineering and Photonics (IMP)
Date Deposited: 22 Apr 2022 11:27
Last Modified: 28 Apr 2022 11:28
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