Hirmer, Katrin ; Hofmann, Klaus ; Casper, Thorben ; Schöps, Sebastian (2019):
3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements.
In: 2019 Kleinheubach Conference,
IEEE, URSI Kleinheubacher Tagung (KHB 2019), Miltenberg, Germany, 23.-25.09.2019, ISBN 978-3-948571-00-9,
[Conference or Workshop Item]
URL / URN: https://ieeexplore.ieee.org/document/8890092
Abstract
This paper proposes 3D field simulation models for different designs of integrated bond wire on-chip inductors. To validate the simulation models, prototypes for three designs with air and ferrite cores are manufactured and measured. For air core inductors, high agreement between simulation and measurement is obtained. For ferrite core inductors, accurate models require an exact characterization of the ferrite material. These models enable the prediction of magnetic field influences on underlying integrated circuits.
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