Casper, Thorben ; Römer, Ulrich ; De Gersem, Herbert ; Schöps, Sebastian (2019)
Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging.
In: Computers & Mathematics with Applications
doi: 10.1016/j.camwa.2019.10.009
Article, Bibliographie

Item Type:	Article
Erschienen:	2019
Creators:	Casper, Thorben ; Römer, Ulrich ; De Gersem, Herbert ; Schöps, Sebastian
Type of entry:	Bibliographie
Title:	Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging
Language:	English
Date:	November 2019
Journal or Publication Title:	Computers & Mathematics with Applications
DOI:	10.1016/j.camwa.2019.10.009
URL / URN:	https://www.sciencedirect.com/science/article/pii/S089812211...
Corresponding Links:	https://arxiv.org/abs/1809.09034
Divisions:	18 Department of Electrical Engineering and Information Technology 18 Department of Electrical Engineering and Information Technology > Institute for Accelerator Science and Electromagnetic Fields > Computational Electromagnetics 18 Department of Electrical Engineering and Information Technology > Institute for Accelerator Science and Electromagnetic Fields Exzellenzinitiative Exzellenzinitiative > Graduate Schools Exzellenzinitiative > Graduate Schools > Graduate School of Computational Engineering (CE)
Date Deposited:	18 Nov 2019 14:17
Last Modified:	18 Nov 2019 14:17
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