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Determination of Bond Wire Failure Probabilities in Microelectronic Packages

Casper, Thorben and Römer, Ulrich and Schöps, Sebastian (2016):
Determination of Bond Wire Failure Probabilities in Microelectronic Packages.
In: THERMINIC 2016, [Online-Edition: http://www.therminic2016.eu],
[Conference or Workshop Item]

Item Type: Conference or Workshop Item
Erschienen: 2016
Creators: Casper, Thorben and Römer, Ulrich and Schöps, Sebastian
Title: Determination of Bond Wire Failure Probabilities in Microelectronic Packages
Language: German
Divisions: 18 Department of Electrical Engineering and Information Technology
18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory (from 01.01.2019 renamed Institute for Accelerator Science and Electromagnetic Fields)
18 Department of Electrical Engineering and Information Technology > Institute of Electromagnetic Field Theory (from 01.01.2019 renamed Institute for Accelerator Science and Electromagnetic Fields) > Computational Engineering (from 01.01.2019 renamed Computational Electromagnetics)
Exzellenzinitiative
Exzellenzinitiative > Graduate Schools
Exzellenzinitiative > Graduate Schools > Graduate School of Computational Engineering (CE)
Event Title: THERMINIC 2016
Date Deposited: 30 Aug 2017 06:27
Official URL: http://www.therminic2016.eu
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