TU Darmstadt / ULB / TUbiblio

Simulation of thermal induced package effects with regard to piezoresistive pressure sensors

Schilling, Frank (1997):
Simulation of thermal induced package effects with regard to piezoresistive pressure sensors.
In: Sensors and actuators. A 60 (1997), S. 37-39, [Article]

Item Type: Article
Erschienen: 1997
Creators: Schilling, Frank
Title: Simulation of thermal induced package effects with regard to piezoresistive pressure sensors
Language: English
Journal or Publication Title: Sensors and actuators. A 60 (1997), S. 37-39
Divisions: 18 Department of Electrical Engineering and Information Technology
Date Deposited: 19 Nov 2008 16:04
License: [undefiniert]
Export:
Suche nach Titel in: TUfind oder in Google
Send an inquiry Send an inquiry

Options (only for editors)
Show editorial Details Show editorial Details