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Comparing New Dielectric Materials for Chip-on-Board LED Packages

Hui, Zhang and Wagner, Max and Khanh, Tran Quoc :
Comparing New Dielectric Materials for Chip-on-Board LED Packages.
In: LED professional Review (LpR) (58) pp. 50-53. ISSN 1993-890X
[Article] , (2016)

Abstract

Light-emitting diodes used in automotive headlamps do not radiate much heat as they light up, but they create heat within the chip, or die, when the electricity passes through, which can compromise the cooling of adjacent assemblies and connectivity cables. For this reason, LED headlamps need cooling systems, such as heatsinks or fans. Also, although these solid-state devices will last a long time when they are operated at low currents and temperatures (as long as 25,000 to 100,000 hours), heat and current settings can extend or shorten this time significantly. High-power LEDs are subjected to higher junction temperatures and higher current densities than traditional devices. This causes stress on the material and may cause early light-output degradation.

Item Type: Article
Erschienen: 2016
Creators: Hui, Zhang and Wagner, Max and Khanh, Tran Quoc
Title: Comparing New Dielectric Materials for Chip-on-Board LED Packages
Language: English
Abstract:

Light-emitting diodes used in automotive headlamps do not radiate much heat as they light up, but they create heat within the chip, or die, when the electricity passes through, which can compromise the cooling of adjacent assemblies and connectivity cables. For this reason, LED headlamps need cooling systems, such as heatsinks or fans. Also, although these solid-state devices will last a long time when they are operated at low currents and temperatures (as long as 25,000 to 100,000 hours), heat and current settings can extend or shorten this time significantly. High-power LEDs are subjected to higher junction temperatures and higher current densities than traditional devices. This causes stress on the material and may cause early light-output degradation.

Journal or Publication Title: LED professional Review (LpR)
Number: 58
Publisher: Luger Research e.U.
Divisions: 18 Department of Electrical Engineering and Information Technology > Institute for Electromechanical Design > Light Technology
18 Department of Electrical Engineering and Information Technology > Institute for Electromechanical Design
18 Department of Electrical Engineering and Information Technology
Date Deposited: 17 Apr 2017 08:58
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