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Thermal simulation and characterisation of the reliability of terahertz Schottky diodes

Brandt, Michael ; Schüßler, M. ; Parmeggiani, E. ; Lin, C. ; Simon, A. ; Hartnagel, H. L. (1997)
Thermal simulation and characterisation of the reliability of terahertz Schottky diodes.
In: Microelectronics Reliability, 37 (10-11)
doi: 10.1016/S0026-2714(97)00134-0
Artikel, Bibliographie

Kurzbeschreibung (Abstract)

Pulsed stress reliability investigations have been carried out for Schottky diodes. A thermal characterisation of the devices is performed using a numerical, coupled electrical thermal SPICE simulator. Different degradation mechanisms have been identified investigated. A comparison between thermal stress and electrical stress shows an influence of the operating current density and the anode diameter on the device degradation. Analytical calculations, simulation results, and results from the Wunsch-Bell model have been compared.

Typ des Eintrags: Artikel
Erschienen: 1997
Autor(en): Brandt, Michael ; Schüßler, M. ; Parmeggiani, E. ; Lin, C. ; Simon, A. ; Hartnagel, H. L.
Art des Eintrags: Bibliographie
Titel: Thermal simulation and characterisation of the reliability of terahertz Schottky diodes
Sprache: Englisch
Publikationsjahr: 1 Oktober 1997
Verlag: Elsevier
Titel der Zeitschrift, Zeitung oder Schriftenreihe: Microelectronics Reliability
Jahrgang/Volume einer Zeitschrift: 37
(Heft-)Nummer: 10-11
DOI: 10.1016/S0026-2714(97)00134-0
Kurzbeschreibung (Abstract):

Pulsed stress reliability investigations have been carried out for Schottky diodes. A thermal characterisation of the devices is performed using a numerical, coupled electrical thermal SPICE simulator. Different degradation mechanisms have been identified investigated. A comparison between thermal stress and electrical stress shows an influence of the operating current density and the anode diameter on the device degradation. Analytical calculations, simulation results, and results from the Wunsch-Bell model have been compared.

Zusätzliche Informationen:

8th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Arcachon, France, 07. to 10.10.1997

Fachbereich(e)/-gebiet(e): 18 Fachbereich Elektrotechnik und Informationstechnik
18 Fachbereich Elektrotechnik und Informationstechnik > Mikrowellenelektronik
Hinterlegungsdatum: 19 Nov 2008 16:04
Letzte Änderung: 13 Jun 2023 09:27
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