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Switchable adhesion for wafer-handling based on dielectric elastomer stack transducers

Grotepaß, Tanja and Butz, Janis and Förster-Zügel, Florentine and Schlaak, Helmut F. (2016):
Switchable adhesion for wafer-handling based on dielectric elastomer stack transducers.
In: Proceedings of SPIE, In: Smart Structures / NDE. Electroactive Polymer Actuators and Devices (EAPAD) 2016, Las Vegas, US, [Conference or Workshop Item]

Item Type: Conference or Workshop Item
Erschienen: 2016
Creators: Grotepaß, Tanja and Butz, Janis and Förster-Zügel, Florentine and Schlaak, Helmut F.
Title: Switchable adhesion for wafer-handling based on dielectric elastomer stack transducers
Language: English
Title of Book: Proceedings of SPIE
Volume: 9798
Divisions: 18 Department of Electrical Engineering and Information Technology > Institute for Electromechanical Design > Microtechnology and Electromechanical Systems
18 Department of Electrical Engineering and Information Technology > Institute for Electromechanical Design
18 Department of Electrical Engineering and Information Technology
Event Title: Smart Structures / NDE. Electroactive Polymer Actuators and Devices (EAPAD) 2016
Event Location: Las Vegas, US
Date Deposited: 02 May 2016 07:46
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