Wiens, A. and Preis, S. and Kohler, C. and Kienemund, D. and Maune, H. and Bengtsson, O. and Nikfalazar, M. and Binder, J. R. and Heinrich, W. and Jakoby, R. (2015):
Tunable in-package impedance matching for high power transistors based on printed ceramics.
pp. 385-388, Microwave Integrated Circuits Conference (EuMIC), 2015 10th European, [Conference or Workshop Item]
Official URL: http://dx.doi.org/10.1109/EuMIC.2015.7345150
| Item Type: | Conference or Workshop Item |
|---|---|
| Erschienen: | 2015 |
| Creators: | Wiens, A. and Preis, S. and Kohler, C. and Kienemund, D. and Maune, H. and Bengtsson, O. and Nikfalazar, M. and Binder, J. R. and Heinrich, W. and Jakoby, R. |
| Title: | Tunable in-package impedance matching for high power transistors based on printed ceramics |
| Language: | German |
| Uncontrolled Keywords: | III-V semiconductors;ceramic packaging;gallium compounds;high electron mobility transistors;impedance matching;power transistors;wide band gap semiconductors;GaN;HEMT;RF-power transistors;efficiency 47.1 percent;frequency 0.8 GHz to 3 GHz;functional thick film layers;high power transistors;insertion loss;printed ceramics;screen printing process;tunable in-package impedance matching;tunable matching networks;Impedance;Insertion loss;Power generation;Transistors;Tuning;Varactors;Wires;Ceramics;passive components;power amplifiers;tunable filters |
| Divisions: | 18 Department of Electrical Engineering and Information Technology 18 Department of Electrical Engineering and Information Technology > Institute for Microwave Engineering and Photonics > Microwave Engineering 18 Department of Electrical Engineering and Information Technology > Institute for Microwave Engineering and Photonics |
| Event Title: | Microwave Integrated Circuits Conference (EuMIC), 2015 10th European |
| Date Deposited: | 21 Mar 2016 12:01 |
| Official URL: | http://dx.doi.org/10.1109/EuMIC.2015.7345150 |
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