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Tunable in-package impedance matching for high power transistors based on printed ceramics

Wiens, A. ; Preis, S. ; Kohler, C. ; Kienemund, D. ; Maune, H. ; Bengtsson, O. ; Nikfalazar, M. ; Binder, J. R. ; Heinrich, W. ; Jakoby, R. (2015):
Tunable in-package impedance matching for high power transistors based on printed ceramics.
pp. 385-388, Microwave Integrated Circuits Conference (EuMIC), 2015 10th European, [Conference or Workshop Item]

Item Type: Conference or Workshop Item
Erschienen: 2015
Creators: Wiens, A. ; Preis, S. ; Kohler, C. ; Kienemund, D. ; Maune, H. ; Bengtsson, O. ; Nikfalazar, M. ; Binder, J. R. ; Heinrich, W. ; Jakoby, R.
Title: Tunable in-package impedance matching for high power transistors based on printed ceramics
Language: German
Uncontrolled Keywords: III-V semiconductors;ceramic packaging;gallium compounds;high electron mobility transistors;impedance matching;power transistors;wide band gap semiconductors;GaN;HEMT;RF-power transistors;efficiency 47.1 percent;frequency 0.8 GHz to 3 GHz;functional thick film layers;high power transistors;insertion loss;printed ceramics;screen printing process;tunable in-package impedance matching;tunable matching networks;Impedance;Insertion loss;Power generation;Transistors;Tuning;Varactors;Wires;Ceramics;passive components;power amplifiers;tunable filters
Divisions: 18 Department of Electrical Engineering and Information Technology
18 Department of Electrical Engineering and Information Technology > Institute for Microwave Engineering and Photonics > Microwave Engineering
18 Department of Electrical Engineering and Information Technology > Institute for Microwave Engineering and Photonics
Event Title: Microwave Integrated Circuits Conference (EuMIC), 2015 10th European
Date Deposited: 21 Mar 2016 12:01
Official URL: http://dx.doi.org/10.1109/EuMIC.2015.7345150
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