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Tunable in-package impedance matching for high power transistors based on printed ceramics

Wiens, A. and Preis, S. and Kohler, C. and Kienemund, D. and Maune, H. and Bengtsson, O. and Nikfalazar, M. and Binder, J. R. and Heinrich, W. and Jakoby, R. (2015):
Tunable in-package impedance matching for high power transistors based on printed ceramics.
In: Microwave Integrated Circuits Conference (EuMIC), 2015 10th European, [Online-Edition: http://dx.doi.org/10.1109/EuMIC.2015.7345150],
[Conference or Workshop Item]

Item Type: Conference or Workshop Item
Erschienen: 2015
Creators: Wiens, A. and Preis, S. and Kohler, C. and Kienemund, D. and Maune, H. and Bengtsson, O. and Nikfalazar, M. and Binder, J. R. and Heinrich, W. and Jakoby, R.
Title: Tunable in-package impedance matching for high power transistors based on printed ceramics
Language: German
Uncontrolled Keywords: III-V semiconductors;ceramic packaging;gallium compounds;high electron mobility transistors;impedance matching;power transistors;wide band gap semiconductors;GaN;HEMT;RF-power transistors;efficiency 47.1 percent;frequency 0.8 GHz to 3 GHz;functional thick film layers;high power transistors;insertion loss;printed ceramics;screen printing process;tunable in-package impedance matching;tunable matching networks;Impedance;Insertion loss;Power generation;Transistors;Tuning;Varactors;Wires;Ceramics;passive components;power amplifiers;tunable filters
Divisions: 18 Department of Electrical Engineering and Information Technology
18 Department of Electrical Engineering and Information Technology > Institute for Microwave Engineering and Photonics > Microwave Engineering
18 Department of Electrical Engineering and Information Technology > Institute for Microwave Engineering and Photonics
Event Title: Microwave Integrated Circuits Conference (EuMIC), 2015 10th European
Date Deposited: 21 Mar 2016 12:01
Official URL: http://dx.doi.org/10.1109/EuMIC.2015.7345150
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