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Numerical simulation of three-dimensional thermal convection on the array processor DAP 510

Erhard, W. and Schäfer, Michael (1992):
Numerical simulation of three-dimensional thermal convection on the array processor DAP 510.
In: Concurrency: Practice and Experience, Wiley Online Library, pp. 19-35, 4, (1), [Article]

Item Type: Article
Erschienen: 1992
Creators: Erhard, W. and Schäfer, Michael
Title: Numerical simulation of three-dimensional thermal convection on the array processor DAP 510
Language: English
Journal or Publication Title: Concurrency: Practice and Experience
Volume: 4
Number: 1
Publisher: Wiley Online Library
Divisions: 16 Department of Mechanical Engineering
16 Department of Mechanical Engineering > Institute of Numerical Methods in Mechanical Engineering (FNB)
Date Deposited: 27 Mar 2014 11:00
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