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Experimental and Numerical Study of the Effects of Neutral Transport and Chemical Kinetics on Plasma Etching System CF4/Si

Wechsler, K. and Rangelow, I. and Borkowicz, Z. and Durst, F. and Kadinski, L. and Schäfer, M. (1993):
Experimental and Numerical Study of the Effects of Neutral Transport and Chemical Kinetics on Plasma Etching System CF4/Si.
In: Proceedings of International Symposium on Plasma Etching, [Conference or Workshop Item]

Item Type: Conference or Workshop Item
Erschienen: 1993
Creators: Wechsler, K. and Rangelow, I. and Borkowicz, Z. and Durst, F. and Kadinski, L. and Schäfer, M.
Title: Experimental and Numerical Study of the Effects of Neutral Transport and Chemical Kinetics on Plasma Etching System CF4/Si
Language: English
Title of Book: Proceedings of International Symposium on Plasma Etching
Divisions: 16 Department of Mechanical Engineering > Institute of Numerical Methods in Mechanical Engineering (FNB)
16 Department of Mechanical Engineering
Date Deposited: 24 Mar 2014 16:05
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