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Hot Stamped Conductors on Nano-Micro Wires Made by Electroplating for Medical Sensors and Micro-Implants

Rossner, Tim and Lyashenko, Alexandra and Dörsam, Edgar and Sarwar, Reza and Werthschützky, Roland (2013):
Hot Stamped Conductors on Nano-Micro Wires Made by Electroplating for Medical Sensors and Micro-Implants.
In: SENSOR & TEST Conference, Nürnberg, Nürnberg, 14.-16.05.2013, [Conference or Workshop Item]

Abstract

This paper presents a novel concept of hot stamped conductors on wires in a nano- or microscale. The process of producing arrays of wires selectively on the desired contact pad by electroplating of a template foil is described. The new concept provides electrical conductivity by penetration of wire arrays through the conductive layer of a hot stamping foil. Because of the small cross section of the wires, a large surface provides a low resistance between the contact pad and the conductor. With this process the non-conductive layer of the hot stamping foil does not have to be removed. The wires are flexible and provide a good alternative for electrical connection of flexible electronics. Also the process temperature is low, which makes it possible to use materials which are sensitive to high temperatures. When renouncing the use of temperature sensitive materials, this method can be applicable for high temperature operation due to the lack of adhesive or solder.

Item Type: Conference or Workshop Item
Erschienen: 2013
Creators: Rossner, Tim and Lyashenko, Alexandra and Dörsam, Edgar and Sarwar, Reza and Werthschützky, Roland
Title: Hot Stamped Conductors on Nano-Micro Wires Made by Electroplating for Medical Sensors and Micro-Implants
Language: English
Abstract:

This paper presents a novel concept of hot stamped conductors on wires in a nano- or microscale. The process of producing arrays of wires selectively on the desired contact pad by electroplating of a template foil is described. The new concept provides electrical conductivity by penetration of wire arrays through the conductive layer of a hot stamping foil. Because of the small cross section of the wires, a large surface provides a low resistance between the contact pad and the conductor. With this process the non-conductive layer of the hot stamping foil does not have to be removed. The wires are flexible and provide a good alternative for electrical connection of flexible electronics. Also the process temperature is low, which makes it possible to use materials which are sensitive to high temperatures. When renouncing the use of temperature sensitive materials, this method can be applicable for high temperature operation due to the lack of adhesive or solder.

Title of Book: SENSOR & TEST Conference
Place of Publication: Nürnberg
Uncontrolled Keywords: Nanowire, microwire, hot stamping, hot stamped conductors, functional printing, electroplating, electrical contact
Divisions: 16 Department of Mechanical Engineering > Institute of Printing Science and Technology (IDD)
16 Department of Mechanical Engineering > Institut für Produktionstechnik und Umformmaschinen (PtU)
18 Department of Electrical Engineering and Information Technology > Institute for Electromechanical Design > Measurement and Sensor Technology
18 Department of Electrical Engineering and Information Technology > Institute for Electromechanical Design
16 Department of Mechanical Engineering
18 Department of Electrical Engineering and Information Technology
Event Location: Nürnberg
Event Dates: 14.-16.05.2013
Date Deposited: 17 May 2013 07:12
Alternative keywords:
Alternative keywordsLanguage
Nanowire, microwire, hot stamping, hot stamped conductors, functional printing, electroplating, electrical contactEnglish
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