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Hot Stamped Conductors on Nano-Micro Wires Made by Electroplating for Medical Sensors and Micro-Implants

Rossner, Tim ; Lyashenko, Alexandra ; Dörsam, Edgar ; Sarwar, Reza ; Werthschützky, Roland :
Hot Stamped Conductors on Nano-Micro Wires Made by Electroplating for Medical Sensors and Micro-Implants.
SENSOR & TEST Conference Nürnberg
[ Konferenzveröffentlichung] , (2013)

Kurzbeschreibung (Abstract)

This paper presents a novel concept of hot stamped conductors on wires in a nano- or microscale. The process of producing arrays of wires selectively on the desired contact pad by electroplating of a template foil is described. The new concept provides electrical conductivity by penetration of wire arrays through the conductive layer of a hot stamping foil. Because of the small cross section of the wires, a large surface provides a low resistance between the contact pad and the conductor. With this process the non-conductive layer of the hot stamping foil does not have to be removed. The wires are flexible and provide a good alternative for electrical connection of flexible electronics. Also the process temperature is low, which makes it possible to use materials which are sensitive to high temperatures. When renouncing the use of temperature sensitive materials, this method can be applicable for high temperature operation due to the lack of adhesive or solder.

Typ des Eintrags: Konferenzveröffentlichung
Erschienen: 2013
Autor(en): Rossner, Tim ; Lyashenko, Alexandra ; Dörsam, Edgar ; Sarwar, Reza ; Werthschützky, Roland
Titel: Hot Stamped Conductors on Nano-Micro Wires Made by Electroplating for Medical Sensors and Micro-Implants
Sprache: Englisch
Kurzbeschreibung (Abstract):

This paper presents a novel concept of hot stamped conductors on wires in a nano- or microscale. The process of producing arrays of wires selectively on the desired contact pad by electroplating of a template foil is described. The new concept provides electrical conductivity by penetration of wire arrays through the conductive layer of a hot stamping foil. Because of the small cross section of the wires, a large surface provides a low resistance between the contact pad and the conductor. With this process the non-conductive layer of the hot stamping foil does not have to be removed. The wires are flexible and provide a good alternative for electrical connection of flexible electronics. Also the process temperature is low, which makes it possible to use materials which are sensitive to high temperatures. When renouncing the use of temperature sensitive materials, this method can be applicable for high temperature operation due to the lack of adhesive or solder.

Buchtitel: SENSOR & TEST Conference
Ort: Nürnberg
Freie Schlagworte: Nanowire, microwire, hot stamping, hot stamped conductors, functional printing, electroplating, electrical contact
Fachbereich(e)/-gebiet(e): 16 Fachbereich Maschinenbau > Institut für Druckmaschinen und Druckverfahren (IDD)
16 Fachbereich Maschinenbau > Institut für Produktionstechnik und Umformmaschinen (PtU)
18 Fachbereich Elektrotechnik und Informationstechnik > Institut für Elektromechanische Konstruktionen > Mess- und Sensortechnik
18 Fachbereich Elektrotechnik und Informationstechnik > Institut für Elektromechanische Konstruktionen
16 Fachbereich Maschinenbau
18 Fachbereich Elektrotechnik und Informationstechnik
Veranstaltungsort: Nürnberg
Veranstaltungsdatum: 14.-16.05.2013
Hinterlegungsdatum: 17 Mai 2013 07:12
Schlagworte in weiteren Sprachen:
Einzelne SchlagworteSprache
Nanowire, microwire, hot stamping, hot stamped conductors, functional printing, electroplating, electrical contactEnglisch
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