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Fabrication of silicon oxycarbide-based microcomponents via photolithographic and soft lithography approaches

Martínez-Crespiera, S. and Ionescu, E. and Schlosser, M. and Flittner, K. and Mistura, G. and Riedel, R. and Schlaak, H. F. (2011):
Fabrication of silicon oxycarbide-based microcomponents via photolithographic and soft lithography approaches.
In: Sensors and Actuators A: Physical, 169 (1), Elsevier, pp. 242-249, ISSN 09244247,
[Online-Edition: http://dx.doi.org/10.1016/j.sna.2011.04.041],
[Article]

Abstract

This work presents the fabrication of SiOC ceramic microparts starting from a commercially available preceramic polysiloxane. Two different micro structuring techniques were applied, e.g. photolithography and soft-lithography. For both processes, photo-crosslinking of the preceramic polymer was performed. Subsequently, the green microparts were pyrolysed under argon at temperatures between 1000 and 1400 °C to yield ceramic SiOC microcomponents. In this way, ceramic microstructures on Si wafers (with dimensions down to 20 μm) have been obtained by photolithographic techniques; free-standing and complex shaped ceramic microcomponents (aspect ratios up to 3:1) were also produced using soft lithography techniques, i.e. replica molding (RM) followed by micro transfer molding (μTM).

Item Type: Article
Erschienen: 2011
Creators: Martínez-Crespiera, S. and Ionescu, E. and Schlosser, M. and Flittner, K. and Mistura, G. and Riedel, R. and Schlaak, H. F.
Title: Fabrication of silicon oxycarbide-based microcomponents via photolithographic and soft lithography approaches
Language: English
Abstract:

This work presents the fabrication of SiOC ceramic microparts starting from a commercially available preceramic polysiloxane. Two different micro structuring techniques were applied, e.g. photolithography and soft-lithography. For both processes, photo-crosslinking of the preceramic polymer was performed. Subsequently, the green microparts were pyrolysed under argon at temperatures between 1000 and 1400 °C to yield ceramic SiOC microcomponents. In this way, ceramic microstructures on Si wafers (with dimensions down to 20 μm) have been obtained by photolithographic techniques; free-standing and complex shaped ceramic microcomponents (aspect ratios up to 3:1) were also produced using soft lithography techniques, i.e. replica molding (RM) followed by micro transfer molding (μTM).

Journal or Publication Title: Sensors and Actuators A: Physical
Volume: 169
Number: 1
Publisher: Elsevier
Uncontrolled Keywords: Polymer derived ceramics, Photolithography, Soft-lithography, SiOC, Microcomponents
Divisions: 11 Department of Materials and Earth Sciences > Material Science > Dispersive Solids
11 Department of Materials and Earth Sciences > Material Science
11 Department of Materials and Earth Sciences
Date Deposited: 04 Apr 2012 09:13
Official URL: http://dx.doi.org/10.1016/j.sna.2011.04.041
Identification Number: doi:10.1016/j.sna.2011.04.041
Funders: European Community FP6 (MCRTN-019601, PolyCerNet), Bundesministerium für Bildung und Forschung, Berlin, Germany (BMBF, Grant No. 16SV3724), The authors acknowledge also the company Starfire Systems Inc., USA, for providing Polyramic® RD-684a.
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