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Contact epitaxy by deposition of Cu, Ag, Au, Pt, and Ni nanoclusters on (100) surfaces: Size limits and mechanisms

Jarvi, T. T. ; Kuronen, A. ; Meinander, K. ; Nordlund, K. ; Albe, K. (2007)
Contact epitaxy by deposition of Cu, Ag, Au, Pt, and Ni nanoclusters on (100) surfaces: Size limits and mechanisms.
In: Phys. Rev. B, 75 (11)
doi: 10.1103/PhysRevB.75.115422
Artikel, Bibliographie

Kurzbeschreibung (Abstract)

Low-energy deposition of individual metal clusters (6-2000 atoms) on a (100) surface is studied for copper, nickel, platinum, silver, and gold by means of molecular-dynamics simulations. For different temperatures ranging from 0 to 750 K we determine the maximum size of clusters that will achieve complete contact epitaxy upon deposition. The results show that two mechanisms contribute to epitaxial alignment. For the smallest cluster sizes, the heat of adsorption released at the interface will immediately (ps time scales) allow the cluster to melt and become epitaxial by resolidification. This effect gives roughly the same limit for all elements studied. On longer (ns) time scales, the clusters can align epitaxially by thermally actived motion of twinning dislocations. This mechanism leads to much higher limits of epitaxy than the resolidification process. Moreover, the resulting limits differ significantly between the elements.

Typ des Eintrags: Artikel
Erschienen: 2007
Autor(en): Jarvi, T. T. ; Kuronen, A. ; Meinander, K. ; Nordlund, K. ; Albe, K.
Art des Eintrags: Bibliographie
Titel: Contact epitaxy by deposition of Cu, Ag, Au, Pt, and Ni nanoclusters on (100) surfaces: Size limits and mechanisms
Sprache: Englisch
Publikationsjahr: 26 März 2007
Verlag: American Physical Society
Titel der Zeitschrift, Zeitung oder Schriftenreihe: Phys. Rev. B
Jahrgang/Volume einer Zeitschrift: 75
(Heft-)Nummer: 11
DOI: 10.1103/PhysRevB.75.115422
URL / URN: http://prb.aps.org/abstract/PRB/v75/i11/e115422
Kurzbeschreibung (Abstract):

Low-energy deposition of individual metal clusters (6-2000 atoms) on a (100) surface is studied for copper, nickel, platinum, silver, and gold by means of molecular-dynamics simulations. For different temperatures ranging from 0 to 750 K we determine the maximum size of clusters that will achieve complete contact epitaxy upon deposition. The results show that two mechanisms contribute to epitaxial alignment. For the smallest cluster sizes, the heat of adsorption released at the interface will immediately (ps time scales) allow the cluster to melt and become epitaxial by resolidification. This effect gives roughly the same limit for all elements studied. On longer (ns) time scales, the clusters can align epitaxially by thermally actived motion of twinning dislocations. This mechanism leads to much higher limits of epitaxy than the resolidification process. Moreover, the resulting limits differ significantly between the elements.

Fachbereich(e)/-gebiet(e): 11 Fachbereich Material- und Geowissenschaften
11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft
11 Fachbereich Material- und Geowissenschaften > Materialwissenschaft > Fachgebiet Materialmodellierung
Hinterlegungsdatum: 28 Feb 2012 14:57
Letzte Änderung: 12 Jan 2019 21:17
PPN:
Sponsoren: This study was supported by the Academy of Finland, Project No. 205729 under the Center of Excellence in Computational Molecular Science., We also gratefully acknowledge the grants of computer time from CSC, the Finnish IT Centre for Science.
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