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Silicone encapsulation of the piezoresistive composite element as a low-cost packaging for measuring high-pressure

Heinickel, Patrick and Foik, Daniel and Werthschützky, Roland (2011):
Silicone encapsulation of the piezoresistive composite element as a low-cost packaging for measuring high-pressure.
In: Proc. Eurosensors XXV, In: Eurosensor XXV Conference, Athen, Greece, September 4-7, 2011, ISSN 18777058, [Conference or Workshop Item]

Item Type: Conference or Workshop Item
Erschienen: 2011
Creators: Heinickel, Patrick and Foik, Daniel and Werthschützky, Roland
Title: Silicone encapsulation of the piezoresistive composite element as a low-cost packaging for measuring high-pressure
Language: English
Title of Book: Proc. Eurosensors XXV
Divisions: 18 Department of Electrical Engineering and Information Technology > Institute for Electromechanical Design > Measurement and Sensor Technology
18 Department of Electrical Engineering and Information Technology > Institute for Electromechanical Design
18 Department of Electrical Engineering and Information Technology
Event Title: Eurosensor XXV Conference
Event Location: Athen, Greece
Event Dates: September 4-7, 2011
Date Deposited: 17 Oct 2011 10:30
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