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Simulation of thermal induced package effects with regard to piezoresistive pressure sensors

Schilling, Frank (1996):
Simulation of thermal induced package effects with regard to piezoresistive pressure sensors.
In: Proceedings of Eurosensors X, the 10th European Conference on Solid-State Transducers, Sept. 1996, Leuven, Belgium. S. 1221-1224, Heverlee, Belgium: Catholic Univ. Leuven, 1996,
Heverlee, Belgium, Catholic Univ. Leuven, [Conference or Workshop Item]

Item Type: Conference or Workshop Item
Erschienen: 1996
Creators: Schilling, Frank
Title: Simulation of thermal induced package effects with regard to piezoresistive pressure sensors
Language: English
Series Name: Proceedings of Eurosensors X, the 10th European Conference on Solid-State Transducers, Sept. 1996, Leuven, Belgium. S. 1221-1224
Place of Publication: Heverlee, Belgium
Publisher: Catholic Univ. Leuven
Edition: Heverlee, Belgium: Catholic Univ. Leuven, 1996
Divisions: 18 Department of Electrical Engineering and Information Technology
Date Deposited: 19 Nov 2008 15:59
License: [undefiniert]
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