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Numerical Simulation of the heat transfer to suspensions of microencapsulated phase change material (MEPCM)

Dammel, Frank and Stephan, Peter (2007):
Numerical Simulation of the heat transfer to suspensions of microencapsulated phase change material (MEPCM).
In: Proceedings European COMSOL Conference, Vol. 2, S. 630-635, 2007, [Conference or Workshop Item]

Item Type: Conference or Workshop Item
Erschienen: 2007
Creators: Dammel, Frank and Stephan, Peter
Title: Numerical Simulation of the heat transfer to suspensions of microencapsulated phase change material (MEPCM)
Language: English
Series Name: Proceedings European COMSOL Conference, Vol. 2, S. 630-635, 2007
Divisions: 16 Department of Mechanical Engineering
16 Department of Mechanical Engineering > Institute for Technical Thermodynamics (TTD)
Date Deposited: 20 Nov 2008 08:28
License: [undefiniert]
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