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Optimization of thermal fatigue resistance in Pb-based solder alloys for electronic packaging

Lambracht, Petra ; Rettenmayr, M. ; Kempf, B. (2001):
Optimization of thermal fatigue resistance in Pb-based solder alloys for electronic packaging.
In: Euromat 2001: Conference Proceedings. - Milano: Associazione Italiana di Metallurgia, 2001, Milano, Associazione Italiana di Metallurgia, [Conference or Workshop Item]

Item Type: Conference or Workshop Item
Erschienen: 2001
Creators: Lambracht, Petra ; Rettenmayr, M. ; Kempf, B.
Title: Optimization of thermal fatigue resistance in Pb-based solder alloys for electronic packaging
Language: English
Series Name: Euromat 2001: Conference Proceedings. - Milano: Associazione Italiana di Metallurgia, 2001
Place of Publication: Milano
Publisher: Associazione Italiana di Metallurgia
Divisions: 11 Department of Materials and Earth Sciences
Date Deposited: 19 Nov 2008 16:27
License: [undefiniert]
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