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Functionally graded materials by electrochemical processing and infiltration: application to tungsten/copper composites

Jedamzik, Ralf ; Neubrand, Achim ; Rödel, Jürgen (2000):
Functionally graded materials by electrochemical processing and infiltration: application to tungsten/copper composites.
35, In: Journal of Materials Science, (2), pp. 477-486. Springer Nature, ISSN 0022-2461, e-ISSN 1573-4803,
DOI: 10.1023/A:100473590498,
[Article]

Item Type: Article
Erschienen: 2000
Creators: Jedamzik, Ralf ; Neubrand, Achim ; Rödel, Jürgen
Title: Functionally graded materials by electrochemical processing and infiltration: application to tungsten/copper composites
Language: English
Journal or Publication Title: Journal of Materials Science
Volume: 35
Number: 2
Publisher: Springer Nature
Divisions: 11 Department of Materials and Earth Sciences
11 Department of Materials and Earth Sciences > Material Science
11 Department of Materials and Earth Sciences > Material Science > Nonmetallic-Inorganic Materials
Date Deposited: 19 Nov 2008 16:24
DOI: 10.1023/A:100473590498
License: [undefiniert]
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