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Computer simulation of residual stress distribution and microcracking due to thermal expansion anisotropy

Zimmermann, André ; Fuller, Edwin Jr. ; Rödel, Jürgen (2000):
Computer simulation of residual stress distribution and microcracking due to thermal expansion anisotropy.
347-349, In: Materials science forum, pp. 211-216. Trans Tech Publications, ISSN 0255-5476, e-ISSN 1662-9752,
DOI: 10.4028/www.scientific.net/MSF.347-349.211,
[Article]

Item Type: Article
Erschienen: 2000
Creators: Zimmermann, André ; Fuller, Edwin Jr. ; Rödel, Jürgen
Title: Computer simulation of residual stress distribution and microcracking due to thermal expansion anisotropy
Language: English
Journal or Publication Title: Materials science forum
Volume: 347-349
Publisher: Trans Tech Publications
Divisions: 11 Department of Materials and Earth Sciences
11 Department of Materials and Earth Sciences > Material Science
11 Department of Materials and Earth Sciences > Material Science > Nonmetallic-Inorganic Materials
Date Deposited: 19 Nov 2008 16:24
DOI: 10.4028/www.scientific.net/MSF.347-349.211
License: [undefiniert]
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