Wang, D. ; Polat, E. ; Tesmer, H. ; Jakoby, R. (2021)
Wideband evaluation of two types of slow-wave microstrip lines.
In: Electronics Letters, 58 (4)
doi: 10.1049/ell2.12389
Artikel, Bibliographie
Kurzbeschreibung (Abstract)
Abstract The design, characterization and comparison of two widely used approaches in realizing slow-wave effect on microstrip transmission lines, that is stub loaded and defected ground structure loaded microstrip lines are presented in a wide bandwidth (10–67 GHz) for the first time. Transparent substrate and dielectric material are chosen to ease the alignment of electrode and ground plane. Thin dielectric layer are applied to make the comparison prominent. The results indicate that defected ground structure loaded microstrip line has better RF performance in terms of compactness and insertion loss than stub loaded method within the whole band especially in thin film applications.
| Typ des Eintrags: | Artikel |
|---|---|
| Erschienen: | 2021 |
| Autor(en): | Wang, D. ; Polat, E. ; Tesmer, H. ; Jakoby, R. |
| Art des Eintrags: | Bibliographie |
| Titel: | Wideband evaluation of two types of slow-wave microstrip lines |
| Sprache: | Englisch |
| Publikationsjahr: | 4 Dezember 2021 |
| Verlag: | Wiley & Sons |
| Titel der Zeitschrift, Zeitung oder Schriftenreihe: | Electronics Letters |
| Jahrgang/Volume einer Zeitschrift: | 58 |
| (Heft-)Nummer: | 4 |
| DOI: | 10.1049/ell2.12389 |
| URL / URN: | https://ietresearch.onlinelibrary.wiley.com/doi/abs/10.1049/... |
| Kurzbeschreibung (Abstract): | Abstract The design, characterization and comparison of two widely used approaches in realizing slow-wave effect on microstrip transmission lines, that is stub loaded and defected ground structure loaded microstrip lines are presented in a wide bandwidth (10–67 GHz) for the first time. Transparent substrate and dielectric material are chosen to ease the alignment of electrode and ground plane. Thin dielectric layer are applied to make the comparison prominent. The results indicate that defected ground structure loaded microstrip line has better RF performance in terms of compactness and insertion loss than stub loaded method within the whole band especially in thin film applications. |
| Fachbereich(e)/-gebiet(e): | 18 Fachbereich Elektrotechnik und Informationstechnik 18 Fachbereich Elektrotechnik und Informationstechnik > Institut für Mikrowellentechnik und Photonik (IMP) > Mikrowellentechnik 18 Fachbereich Elektrotechnik und Informationstechnik > Institut für Mikrowellentechnik und Photonik (IMP) |
| Hinterlegungsdatum: | 11 Jan 2022 09:48 |
| Letzte Änderung: | 31 Jan 2022 10:05 |
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