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Broadband Terahertz Photonic Integrated Circuit with Integrated Active Photonic Devices

Mukherjee, Amlan kusum ; Xiang, Mingjun ; Preu, Sascha (2021)
Broadband Terahertz Photonic Integrated Circuit with Integrated Active Photonic Devices.
In: Photonics, 8 (11)
doi: 10.3390/photonics8110492
Artikel, Bibliographie

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Kurzbeschreibung (Abstract)

Present-day photonic terahertz (100 GHz–10 THz) systems offer dynamic ranges beyond 100 dB and frequency coverage beyond 4 THz. They yet predominantly employ free-space Terahertz propagation, lacking integration depth and miniaturisation capabilities without sacrificing their extreme frequency coverage. In this work, we present a high resistivity silicon-on-insulator-based multimodal waveguide topology including active components (e.g., THz receivers) as well as passive components (couplers/splitters, bends, resonators) investigated over a frequency range of 0.5–1.6 THz. The waveguides have a single mode bandwidth between 0.5–0.75 THz; however, above 1 THz, these waveguides can be operated in the overmoded regime offering lower loss than commonly implemented hollow metal waveguides, operated in the fundamental mode. Supported by quartz and polyethylene substrates, the platform for Terahertz photonic integrated circuits (Tera-PICs) is mechanically stable and easily integrable. Additionally, we demonstrate several key components for Tera-PICs: low loss bends with radii ∼2 mm, a Vivaldi antenna-based efficient near-field coupling to active devices, a 3-dB splitter and a filter based on a whispering gallery mode resonator.

Typ des Eintrags: Artikel
Erschienen: 2021
Autor(en): Mukherjee, Amlan kusum ; Xiang, Mingjun ; Preu, Sascha
Art des Eintrags: Bibliographie
Titel: Broadband Terahertz Photonic Integrated Circuit with Integrated Active Photonic Devices
Sprache: Englisch
Publikationsjahr: 3 November 2021
Verlag: MDPI
Titel der Zeitschrift, Zeitung oder Schriftenreihe: Photonics
Jahrgang/Volume einer Zeitschrift: 8
(Heft-)Nummer: 11
DOI: 10.3390/photonics8110492
URL / URN: https://www.mdpi.com/2304-6732/8/11/492
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Kurzbeschreibung (Abstract):

Present-day photonic terahertz (100 GHz–10 THz) systems offer dynamic ranges beyond 100 dB and frequency coverage beyond 4 THz. They yet predominantly employ free-space Terahertz propagation, lacking integration depth and miniaturisation capabilities without sacrificing their extreme frequency coverage. In this work, we present a high resistivity silicon-on-insulator-based multimodal waveguide topology including active components (e.g., THz receivers) as well as passive components (couplers/splitters, bends, resonators) investigated over a frequency range of 0.5–1.6 THz. The waveguides have a single mode bandwidth between 0.5–0.75 THz; however, above 1 THz, these waveguides can be operated in the overmoded regime offering lower loss than commonly implemented hollow metal waveguides, operated in the fundamental mode. Supported by quartz and polyethylene substrates, the platform for Terahertz photonic integrated circuits (Tera-PICs) is mechanically stable and easily integrable. Additionally, we demonstrate several key components for Tera-PICs: low loss bends with radii ∼2 mm, a Vivaldi antenna-based efficient near-field coupling to active devices, a 3-dB splitter and a filter based on a whispering gallery mode resonator.

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Erstveröffentlichung

Fachbereich(e)/-gebiet(e): 18 Fachbereich Elektrotechnik und Informationstechnik
18 Fachbereich Elektrotechnik und Informationstechnik > Institut für Mikrowellentechnik und Photonik (IMP)
18 Fachbereich Elektrotechnik und Informationstechnik > Institut für Mikrowellentechnik und Photonik (IMP) > THz Bauelemente und THz Systeme
18 Fachbereich Elektrotechnik und Informationstechnik > Institut für Mikrowellentechnik und Photonik (IMP) > Terahertz Systems
TU-Projekte: EC/H2020|713780|Pho-T-Lyze
Hinterlegungsdatum: 04 Nov 2021 09:52
Letzte Änderung: 13 Mär 2024 14:10
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