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System Integration and Packaging of a Terahertz Photodetector at W-Band

Dong, Yunfeng and Fernandez Olvera, Anuar de Jesus and Morales, Alvaro and Aller, Mario Méndez and Preu, Sascha and Zhurbenko, Vitaliy and Hanberg, Peter Jesper and Okonkwo, Chigo and Monroy, Idelfonso Tafur and Johansen, Tom Keinicke (2019):
System Integration and Packaging of a Terahertz Photodetector at W-Band.
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, pp. 1486-1494, 9, (8), ISSN 2156-3950,
DOI: 10.1109/TCPMT.2019.2928053,
[Online-Edition: https://doi.org/10.1109/TCPMT.2019.2928053],
[Article]

Item Type: Article
Erschienen: 2019
Creators: Dong, Yunfeng and Fernandez Olvera, Anuar de Jesus and Morales, Alvaro and Aller, Mario Méndez and Preu, Sascha and Zhurbenko, Vitaliy and Hanberg, Peter Jesper and Okonkwo, Chigo and Monroy, Idelfonso Tafur and Johansen, Tom Keinicke
Title: System Integration and Packaging of a Terahertz Photodetector at W-Band
Language: English
Journal or Publication Title: IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume: 9
Number: 8
Divisions: 18 Department of Electrical Engineering and Information Technology
18 Department of Electrical Engineering and Information Technology > Institute for Microwave Engineering and Photonics
18 Department of Electrical Engineering and Information Technology > Institute for Microwave Engineering and Photonics > Terahertz Systems Technology
Date Deposited: 28 Oct 2019 10:48
DOI: 10.1109/TCPMT.2019.2928053
Official URL: https://doi.org/10.1109/TCPMT.2019.2928053
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