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System Integration and Packaging of a Terahertz Photodetector at W-Band

Dong, Yunfeng ; Fernandez Olvera, Anuar de Jesus ; Morales, Alvaro ; Méndez Aller, Mario ; Preu, Sascha ; Zhurbenko, Vitaliy ; Hanberg, Peter Jesper ; Okonkwo, Chigo ; Monroy, Idelfonso Tafur ; Johansen, Tom Keinicke (2019):
System Integration and Packaging of a Terahertz Photodetector at W-Band.
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (8), pp. 1486-1494. ISSN 2156-3950,
DOI: 10.1109/TCPMT.2019.2928053,
[Article]

Item Type: Article
Erschienen: 2019
Creators: Dong, Yunfeng ; Fernandez Olvera, Anuar de Jesus ; Morales, Alvaro ; Méndez Aller, Mario ; Preu, Sascha ; Zhurbenko, Vitaliy ; Hanberg, Peter Jesper ; Okonkwo, Chigo ; Monroy, Idelfonso Tafur ; Johansen, Tom Keinicke
Title: System Integration and Packaging of a Terahertz Photodetector at W-Band
Language: English
Journal or Publication Title: IEEE Transactions on Components, Packaging and Manufacturing Technology
Journal Volume: 9
Issue Number: 8
Divisions: 18 Department of Electrical Engineering and Information Technology
18 Department of Electrical Engineering and Information Technology > Institute for Microwave Engineering and Photonics (IMP)
18 Department of Electrical Engineering and Information Technology > Institute for Microwave Engineering and Photonics (IMP) > Terahertz Devices and Systems
18 Department of Electrical Engineering and Information Technology > Institute for Microwave Engineering and Photonics (IMP) > Terahertz Systems Technology
Date Deposited: 28 Oct 2019 10:48
DOI: 10.1109/TCPMT.2019.2928053
URL / URN: https://doi.org/10.1109/TCPMT.2019.2928053
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